Detachable Multi-Chip Package for Replaceable Memory Modules
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Solution Overview
Problem
Conventional multi-chip packages (MCPs) have permanently attached semiconductor modules, making it impossible to replace defective modules or upgrade storage capacity, as the entire package becomes unusable if one module fails.
Innovation Solution
A multi-chip package design featuring a substrate, semiconductor modules, an interposer, and a housing that transitions between closed and open configurations, allowing for detachable semiconductor modules, enabling replacement and upgrade of modules without damaging existing connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor modules are permanently attached to the substrate, then the package structure is stable and reliable, but the modules cannot be replaced or upgraded when defective or obsolete
Solution Approach 1:
The package is divided into a permanent base structure (substrate with first module) and a detachable module (second module). The detachable module can be separated from the package when defective or obsolete, while the permanent structure remains intact. This segmentation enables module replacement without damaging the entire package.
Solution Approach 2:
The coupling between the first and second modules transitions from a fixed state to a detachable state. The second module is initially coupled to the first module in a closed configuration, but can be detached when needed. This dynamic coupling allows the package to adapt between stable operation and module replacement.
2Reliability
If modules are fixedly connected via bond wires, then electrical connections are reliable, but the entire package becomes unusable when one module fails
Solution Approach 1:
The electrical connection structure is segmented into permanent connections (substrate to first module) and detachable connections (first module to second module). The bond wires connecting the first module to the substrate remain permanently fixed and reliable, while the connection to the second module can be detached. This allows the second module to be replaced without affecting the permanent electrical connections.
Solution Approach 2:
The first module acts as an intermediary between the substrate and the second module. It provides permanent electrical connections to the substrate while also serving as a coupling interface for the detachable second module. This intermediary structure enables independent replacement of the second module while maintaining reliable electrical connections through the first module.
3Object-affected harmful factors
If the housing encloses all modules, then the package is protected, but defective modules cannot be accessed for replacement
Solution Approach 1:
The housing is segmented into a permanent base structure and a detachable cover. The cover can be separated from the base to provide access to the detachable module, while the permanent structure remains enclosed and protected. This segmentation allows the module to be accessed for replacement while maintaining protection when the cover is attached.
Solution Approach 2:
The housing transitions from a closed enclosed state to an open accessible state. The cover can be detached or opened to allow access to the second module for replacement, then reattached to restore protection. This dynamic housing structure enables both protection during operation and accessibility during maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the replacement of defective or low-capacity modules with new ones, enhancing the package's reliability and upgradability by allowing users to swap modules, such as NAND or DRAM, without compromising the integrity of the remaining components.
Implementation Method 1
the cover is configured to apply an amount of pressure on the second semiconductor module and first semiconductor module sufficient to prevent the first and second plurality of conductive pads from moving out of direct contact with one another
Implementation Method 2
the cover comprises a heat sink composed of a material having a thermal conductivity of at least about 150 W/m*K
Data Source
AI summary
A multi-chip package includes a substrate, a first semiconductor module mounted on the substrate, an interposer mounted on the first semiconductor module and a second semiconductor module detachably coupled to the interposer. A housing at least partially encloses the first and second semiconductor modules and the interposer. The housing is configured to transition between a closed configuration and an open configuration. In the closed configuration, the second semiconductor module is fixed in position relative to the interposer and electrically connected to the substrate via the interposer, and in the open configuration the second semiconductor module is detachable from the interposer. The second semiconductor module being detachable from the interposer allows for the second semiconductor module to be selectively replaced to improve the longevity of the multi-chip package.