Detachable Electrostatic Chuck With Flexible Feedthrough Alignment
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Solution Overview
Problem
In high temperature applications, electrostatic chucks in substrate processing systems face misalignment and thermal expansion issues with feedthrough connections, leading to maintenance challenges and increased costs.
Innovation Solution
A substrate support system with a detachable electrostatic chuck featuring a ceramic puck and a base plate assembly, where a flexible connector and floating nuts allow for thermal expansion differences, and electrical feedthroughs rated for high voltage, along with a resistive heater and cooling system, are used to maintain alignment and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If the electrostatic chuck is made detachable to reduce maintenance time and cost, then ease of repair is improved, but misalignment and thermal expansion effects with feedthrough connections worsen at high temperatures
Solution Approach 1:
The patent employs floating nuts that allow the ceramic puck to move dynamically with thermal expansion while maintaining electrical contact through spring-loaded feedthroughs. This dynamic adjustment mechanism resolves the contradiction by enabling the detachable chuck to accommodate high-temperature expansion without misalignment, thus maintaining reliability while preserving ease of repair.
Solution Approach 2:
The patent changes the physical parameters of the connection system by using spring-loaded feedthroughs that adjust their compression force and floating nuts that adjust their position based on thermal expansion. These parameter changes allow the detachable chuck to maintain stable alignment across temperature variations, resolving the reliability concern while keeping the detachable design for ease of repair.
2Ease of operation
If the electrostatic chuck is made detachable, then ease of operation is improved, but thermal expansion effects with respect to feedthrough connections worsen
Solution Approach 1:
The floating nut mechanism allows the ceramic puck to dynamically adjust its position during thermal expansion, maintaining proper alignment with feedthroughs. This dynamic capability enables easy replacement while compensating for thermal effects that would otherwise compromise alignment stability.
Solution Approach 2:
The spring-loaded feedthroughs act as intermediaries between the detachable ceramic chuck and the base plate assembly. These intermediaries absorb thermal expansion effects through spring compression while maintaining electrical and mechanical connection, thus preserving alignment stability during easy replacement operations.
3Power
If high voltage electrical feedthroughs are used for high temperature applications, then power transmission capability is improved, but susceptibility to thermal expansion misalignment worsens
Solution Approach 1:
The spring-loaded feedthroughs provide a dynamic connection that maintains electrical contact under varying thermal conditions. The spring mechanism compensates for alignment shifts caused by thermal expansion, ensuring continuous power transmission to high-voltage electrodes while preserving manufacturing precision despite temperature variations.
Solution Approach 2:
The patent changes the mechanical parameters of the feedthrough connection by introducing spring loading and floating nut adjustment capabilities. These parameter changes allow the high-voltage feedthroughs to maintain precise alignment and electrical contact despite thermal expansion, thus preserving both power transmission capability and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces maintenance time and costs by accommodating thermal expansion, ensuring reliable operation and precise temperature control in high-temperature substrate processing.
Implementation Method 1
a first resistive heater embedded in the ceramic puck and electrically coupled to a second pair of the electrical feedthroughs
Data Source
AI summary
Embodiments of a substrate support are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes a lower assembly having a base plate assembly, wherein the base plate assembly includes a plurality of electrical feedthroughs disposed about a central protrusion; a ceramic puck disposed on the lower assembly and removeably coupled to the base plate assembly, wherein the ceramic puck has an electrode disposed therein that is electrically coupled to first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and a flexible connector having a spiral portion disposed between the ceramic puck and each of the plurality of electrical feedthroughs to allow for differences in thermal expansion of the ceramic puck and the base plate assembly.