Detachable Cooling Device Linking Structure for Deformation-Free Grouping

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Solution Overview

Problem

Existing methods for grouping cooling devices result in deformation, compromising their aesthetic appearance and reducing insulation thickness, which in turn decreases cooling performance.

Innovation Solution

A linking mechanism featuring detachable support members with extensions and a connection member, allowing for secure grouping without deformation, utilizing symmetrical and identical support members produced by metal extrusion, with ribs and screw paths for enhanced connection, enabling easy assembly and disassembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If connection holes are formed on the outer surfaces of cooling devices and connectors are used to hold them together, then the cooling devices can be grouped together, but deformation occurs on the cooling devices which deteriorates their esthetic appearance and reduces insulation thickness

Engineering Contradiction:
Improvegrouping stabilityVSAvoiddeformation
Core Design Contradiction:
Stability of the object's compositionVSShape

Solution Approach 1:

The invention divides the connection system into separate components: support members attached to the cooling devices and a connector joining the support members. This segmentation allows the cooling devices themselves to remain undeformed while achieving stable grouping through the auxiliary support structures.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Support members act as intermediary elements between the cooling devices and the connector. These support members bear the mechanical load of connection, preventing direct deformation of the cooling devices while enabling stable grouping through the intermediate structural layer.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Stability of the object's composition

If connection holes are formed on the outer surfaces of cooling devices, then the cooling devices can be grouped together, but the insulation thickness decreases at the deformation portions which decreases cooling performance

Engineering Contradiction:
Improvegrouping stabilityVSAvoidcooling performance
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The connection system is segmented into support members and connectors, allowing the cooling devices to maintain their original insulation thickness. The support members provide the necessary structural interface for connection without compromising the thermal insulation integrity of the cooling devices themselves.

Inventive Principle:
Principle #1Segmentation

3Stability of the object's composition

If support members are permanently fixed to cooling devices, then firm grouping is achieved, but the cooling devices cannot be easily separated when needed

Engineering Contradiction:
Improvegrouping stabilityVSAvoidseparation ease
Core Design Contradiction:
Stability of the object's compositionVSEase of operation

Solution Approach 1:

The connection system employs detachable support members that can be dynamically attached and detached from the cooling devices. This dynamic characteristic allows the system to transition between connected and separated states, providing both stable grouping when connected and easy separation when needed, without compromising the firmness of the connection during use.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentEP3003093B1Cooling devices connected together
Publication Date: 2019.02.06 ARCELIK AS
  • EP3003093B1 patent drawingFigure 1
  • EP3003093B1 patent drawingFigure 2~3
  • EP3003093B1 patent drawingFigure 4

AI summary

The present invention relates to a linking mechanism (1) that is suitable to connect two cooling devices (C1, C2) placed side by side to each other, and that comprises a first support member (2) that is mounted on the side wall of one of the cooling devices (C1) and a second support member (102) mounted on the side wall of the other cooling device (C2).