Photonic IC Packages With Detachable Expanded-Beam Connectors
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Solution Overview
Problem
Packaging photonic integrated circuits (PICs) faces challenges in achieving high-density, high-bandwidth electrical communication with tight-pitch interconnects and stable optical coupling, leading to manufacturing inefficiencies and increased costs due to fragile fiber pigtails and alignment issues.
Innovation Solution
The implementation of paired attachable/detachable expanded beam connectors, with one connector on-package and the other off-package, allowing for collimated and expanded optical coupling, facilitating stable optical alignment and reducing handling challenges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fiber pigtails are used for optical coupling, then optical connection is achieved, but handling difficulty and fragility increase
Solution Approach 1:
The optical coupling system is segmented into two separate connectors: an on-package connector integrated with the PIC and an off-package connector with fiber array. This segmentation eliminates fragile fiber pigtails from the package interior while maintaining stable optical coupling through the interface between the two connectors.
Solution Approach 2:
The on-package expanded beam connector acts as an intermediary between the PIC and the off-package fiber array connector. It provides a robust mechanical and optical interface that mediates the connection, transferring optical signals while protecting against misalignment and physical damage.
2Productivity
If tight-pitch interconnects are used for high-density electrical communication, then bandwidth increases, but manufacturing complexity increases
Solution Approach 1:
The interconnect system is divided into electrical interconnects on the substrate and optical interconnects through the expanded beam connector. This segmentation allows each subsystem to be optimized independently, simplifying manufacturing while achieving high-density communication through the hybrid electrical-optical interface.
3Manufacturing precision
If fiber alignment is performed manually, then alignment precision can be achieved, but manufacturing time increases
Solution Approach 1:
The on-package expanded beam connector is pre-aligned and integrated with the PIC during semiconductor fabrication. This preliminary alignment eliminates the need for manual fiber alignment during assembly, achieving high precision through automated manufacturing processes while maintaining high production speed.
Solution Approach 2:
Manual mechanical fiber alignment is replaced by an integrated expanded beam optical system with built-in alignment features. The optical elements are precisely positioned through semiconductor manufacturing processes, substituting manual mechanical adjustment with automated fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances manufacturing efficiency by enabling reliable optical coupling and reducing defects, thereby improving yield and lowering costs in high-volume manufacturing.
Implementation Method 1
a second optical element (188) to expand and collimate an optical beam
Data Source
AI summary
Photonic IC packages, related devices and methods, are disclosed herein. In some embodiments, a photonic package may include a substrate including a dielectric material with conductive pathways; a photonic integrated circuit (PIC) having a first optical element, the PIC electrically coupled to the substrate; a connector including a fiber alignment structure; and a second optical element, wherein the second optical element is to expand and collimate an optical beam; and a fiber having a first end and an opposing second end, wherein the fiber is positioned in the fiber alignment structure, and wherein the first end of the fiber is optically coupled to the first optical element and the second end of the fiber is optically coupled to the second optical element.