Detachable Heat-Receiving Accessory for Electronic Device Cooling
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Solution Overview
Problem
Existing cooling technologies for electronic devices face complications such as the need for power supplies and pumps, leading to complex configurations, and can cause dew condensation due to large temperature differences between cooling targets and refrigerants.
Innovation Solution
A detachable water-cooled accessory that uses a refrigerant contained in a containment vessel, where heat is transferred indirectly from the electronic device to the refrigerant through a heatsink and accessory heat receiving members, eliminating the need for direct refrigerant circulation and reducing dew condensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan-driven air cooling system is used, then cooling effect is achieved, but device complexity increases due to power supply requirements
Solution Approach 1:
The patent replaces the mechanical fan-driven air cooling system with a passive liquid cooling system that uses natural convection and thermal conduction. The cooling liquid circulates through heat receiving members that contact the electronic device, transferring heat without requiring mechanical fans or power supplies, thus achieving cooling while simplifying the device configuration
Solution Approach 2:
The patent introduces a liquid cooling mechanism where cooling liquid flows through containment vessels and heat receiving members. This hydraulic approach replaces the aerodynamic fan-based system, using fluid thermal properties for heat transfer and eliminating the need for electrical power and mechanical components
2Temperature
If refrigerant circulation is used for cooling, then cooling effect is achieved, but device complexity increases due to pump and tube requirements
Solution Approach 1:
The patent extracts the complex pump and tube circulation system from the cooling mechanism. Instead of actively circulating refrigerant through a closed loop with pumps and tubes, the design uses passive heat receiving members that directly contact the electronic device and transfer heat to cooling liquid in containment vessels, eliminating the need for active circulation components
Solution Approach 2:
The patent introduces heat receiving members as intermediary components between the electronic device and the cooling liquid. These members facilitate thermal transfer without requiring direct refrigerant contact or complex circulation systems, serving as a simple thermal bridge that simplifies the overall cooling architecture
3Productivity
If direct refrigerant contact cooling is used, then cooling efficiency is improved, but dew condensation occurs due to large temperature difference
Solution Approach 1:
The patent uses heat receiving members as intermediaries between the electronic device and cooling liquid, preventing direct contact between the cooling medium and the device surface. This intermediate layer moderates the temperature transition, maintaining cooling efficiency while preventing the large temperature differential that causes dew condensation on the device exterior
Solution Approach 2:
The patent applies cooling locally at the heat receiving members that contact the electronic device, rather than cooling the entire device surface. This localized approach maintains optimal temperature differential for heat transfer while preventing excessive cooling that would cause dew condensation on other device surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient heat dissipation with a simple configuration, reducing the risk of dew condensation and maintaining a stable temperature, while avoiding the complexity of traditional cooling systems.
Implementation Method 1
heat is transferred indirectly from the electronic device to the refrigerant through a heatsink and accessory heat receiving members
Implementation Method 2
heat is transferred indirectly from the electronic device to the refrigerant through a heatsink and accessory heat receiving members
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
To provide an electronic device that can be cooled while suppressing dew condensation on the electronic device with a simple configuration. The electronic device (100) to which a cooling device (200) is detachably attachable, including an electronic component (131, 133) as a heat source, a heat dissipation member (135) having thermal conductivity, and a first heat transfer member (134) configured to thermally connect the electronic component and the heat dissipation member. A heat receiving member (203) of the cooling device and the heat dissipation member are thermally connected in a case where the cooling device is attached to the electronic device.