Detachable Interconnect Structures for IC Package Yield
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Solution Overview
Problem
Integrated circuit packages face challenges in creating reliable stacking structures for multiple dies, particularly due to high yield loss and increased costs associated with embedded silicon bridges, which complicate die-to-die connections and require expensive substrate consumption before assembly testing.
Innovation Solution
The implementation of detachable interconnect structures, comprising conductive structures on a base substrate that can be attached to integrated circuit dies via conductive bumps, allowing for removable and flexible connections that eliminate the need for interposer substrates and enable wafer-level testing without specialized equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If embedded silicon bridge is used to enable high-density die-to-die connection, then connection density is improved, but manufacturing yield loss increases and fabrication cost increases
Solution Approach 1:
The patent segments the interconnect structure into separate conductive structures that can be independently formed on the base substrate and independently connected to each die. This segmentation allows for easier replacement of defective components without requiring complete rework of the entire assembly, thereby improving manufacturing yield while maintaining high connection density.
Solution Approach 2:
The patent changes the structural parameters of the interconnect from embedded silicon bridges to detachable conductive structures with conductive bumps. This parameter change enables modular assembly and testing, allowing defective dies or interconnects to be identified and replaced individually, thus reducing yield loss and fabrication costs.
2Reliability
If embedded silicon bridge is used for die-to-die connection, then connection reliability is improved, but device complexity increases and testing becomes complicated
Solution Approach 1:
The patent introduces dynamic characteristics to the interconnect structure by making the conductive structures detachable rather than permanently embedded. This allows the assembly to be disassembled and reassembled for testing and repair purposes, reducing complexity in quality control and maintenance while maintaining connection reliability during operation.
Solution Approach 2:
The base substrate acts as an intermediary component that holds the detachable conductive structures, facilitating easier testing and assembly processes. The conductive bumps serve as intermediaries for electrical connection, enabling standardized interfaces that simplify the overall assembly complexity while maintaining reliable connections.
3Stability of the object's composition
If embedded silicon bridge is implemented, then substrate integration is improved, but substrate cost increases due to expensive substrate consumption before assembly testing
Solution Approach 1:
The patent performs preliminary actions by forming the conductive structures on the base substrate before attaching the dies. This allows the substrate and interconnect structures to be prepared and tested separately, enabling early detection of defects and reducing the need to consume expensive substrates on assemblies that may fail during later testing stages.
Solution Approach 2:
The detachable nature of the conductive structures allows for discarding only the defective component (either a die or an interconnect structure) rather than the entire substrate assembly. This selective replacement approach recovers the value of non-defective components and reduces overall substrate consumption and cost.
Data Source
AI summary
An integrated circuit package may include a first integrated circuit die having a first bump structure, a second integrated circuit die having a second bump structure, and a detachable interconnect structure having first and second conductive structures that is positioned between the first and second integrated circuit dies. In order to establish electrical communication between the first and second integrated circuit dies, the first conductive structure of the detachable interconnect structure is connected to the first bump structure of the first integrated circuit die, and the second conductive structure of the detachable interconnect structure is connected to the second bump structure of the second integrated circuit die. The detachable interconnect structure may also be used to facilitate wafer-level testing prior to packaging the first and second integrated circuit dies to form the integrated circuit package.