Detachable Mask for CIGS Solar Cell Patterning
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Solution Overview
Problem
Current substrate processing methods for photovoltaic cells, particularly CIGS thin film solar cells, face challenges in achieving high-quality patterned conductive layers and addressing edge shunts due to the high resistance of top conductive layers and the inefficiencies of existing removal methods like wet bath etching and laser scribing.
Innovation Solution
The use of detachable masks made of hard materials like stainless steel, which are positioned in close proximity to the substrate to allow for precise patterning and etching, enabling the formation of higher conductivity layers and avoiding edge shunts by selectively exposing areas for processing such as sputtering and plasma etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If detachable masks are used for patterning, then manufacturing precision of conductive layers is improved, but device complexity increases
Solution Approach 1:
The mask system is segmented into detachable components that can be separately handled, positioned, and removed. This allows precise positioning of mask patterns on the substrate while simplifying the overall handling process through modular design.
Solution Approach 2:
A carrier substrate is introduced as an intermediary between the mask and the final substrate. The mask is attached to the carrier, which then serves as the handling medium during deposition, eliminating direct complex manipulation of the mask itself.
2Ease of manufacture
If conventional printing technology is used for top conductive layer, then ease of manufacture is improved, but electrical conductivity deteriorates
Solution Approach 1:
The conventional mechanical printing process is replaced with physical vapor deposition through a patterned mask. This substitution enables precise control of material deposition at the atomic level, achieving superior conductivity while maintaining ease of manufacture through automated deposition processes.
3Ease of operation
If wet bath etching is used for edge shunt removal, then ease of operation is improved, but manufacturing precision deteriorates
Solution Approach 1:
A detachable mask serves as an intermediary that precisely defines the etch boundary. The mask is positioned to expose only the edge region requiring shunt removal, allowing controlled plasma or ion beam etching with high precision while maintaining ease of operation through simple mask attachment and removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of patterned layers with improved conductivity and effectively removes edge shunts, enhancing the efficiency and quality of solar cell fabrication while reducing processing time and costs.
Implementation Method 1
allowing for precise patterning and etching, enabling the formation of higher conductivity layers and avoiding edge shunts by selectively exposing areas for processing such as sputtering
Implementation Method 2
selectively exposing areas for processing such as sputtering and plasma etching
Data Source
AI summary
Apparatus and methods are provided that enable processing of patterned layers on substrates using a detachable mask. Unlike prior art where the mask is formed directly over the substrate, according to aspects of the invention the mask is made independently of the substrate. During use, the mask is positioned in close proximity or in contact with the substrate so as to expose only portions of the substrate to processing, e.g., sputtering or etch. Once the processing is completed, the mask is moved away from the substrate and may be used for another substrate. The substrate may be cycled for a given number of substrates and then be removed for cleaning or disposal.