Detachable Optical Connector Thermal Expansion Matching
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Solution Overview
Problem
Current methods for connecting optical fibers to optical chips require expensive and time-consuming active alignment processes, and the fibers cannot withstand elevated temperatures during solder reflow, preventing pre-assembly testing and causing misalignment due to coefficient of thermal expansion mismatches.
Innovation Solution
The development of detachable optical connectors with a ferrule and waveguide support that matches the coefficient of thermal expansion of the optical chip, allowing for repeatable mating and demating, and withstanding solder reflow temperatures, enabling pre-assembly testing and reducing misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment process is used to connect optical fibers to optical chips, then alignment precision is improved, but manufacturing cost and time consumption increase significantly
Solution Approach 1:
The patent applies preliminary action by pre-aligning and pre-bonding the optical connector to the optical chip before final assembly. The connector is positioned and bonded in place prior to module completion, eliminating the need for time-consuming active alignment processes during final assembly while maintaining precise alignment through the pre-positioning step.
Solution Approach 2:
The patent segments the assembly process into distinct phases: first bonding the optical connector to the optical chip substrate, then completing the module assembly afterward. This segmentation allows the alignment-critical connection to be established independently before final assembly, reducing overall manufacturing time and complexity.
2Reliability
If optical fibers are permanently affixed to optical chips after final assembly, then connection stability is improved, but testing capability is reduced due to inability to test before bonding
Solution Approach 1:
The patent enables preliminary testing by allowing the optical connector to be bonded to the optical chip before final module assembly. This preliminary bonding creates a stable connection that can be tested independently, and the connector can be repositioned or replaced if testing reveals issues, thereby maintaining both stability and testing capability.
Solution Approach 2:
The patent introduces dynamic adjustability by allowing the optical connector to be repositioned and re-bonded at different locations on the optical chip substrate. This dynamic capability enables optimization of alignment and performance through multiple positioning attempts, while still achieving permanent fixation in the final configuration.
3Reliability
If optical fibers are attached after solder reflow process, then fiber integrity is preserved, but assembly complexity increases due to sequential process requirements
Solution Approach 1:
The patent segments the manufacturing process into two distinct phases: first, bonding the optical connector to the optical chip substrate before solder reflow; second, completing the module assembly and performing solder reflow. This segmentation protects fiber integrity by avoiding exposure to high temperatures during the bonding phase while simplifying the overall assembly sequence.
Solution Approach 2:
The patent changes the temporal parameter of the bonding process by performing the optical connector bonding at lower temperatures before the solder reflow process. This parameter change allows the use of temperature-sensitive bonding materials and methods that would be incompatible with high-temperature soldering, thereby preserving fiber integrity while reducing assembly complexity.
4Adaptability or versatility
If detachable optical connectors are implemented, then reconfigurability is improved, but connection reliability may deteriorate due to repeated mating and demating
Solution Approach 1:
The patent merges the optical connector with the optical chip substrate through direct bonding, creating an integrated assembly that maintains connection reliability comparable to permanent fixtures. This merged structure allows the connector to be repositioned or replaced while maintaining stable optical coupling, thereby achieving reconfigurability without sacrificing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and cost-effective optical connections with reduced insertion loss and thermal stress, allowing for pre-assembly testing and repeated connections, while maintaining alignment and performance across temperature changes.
Implementation Method 1
a ferrule and waveguide support that matches the coefficient of thermal expansion of the optical chip, allowing for repeatable mating and demating, and withstanding solder reflow temperatures
Data Source
Figure 1A
Figure 1B~2
Figure 3~4
AI summary
Detachable optical connectors for optical chips and methods of their fabrication are disclosed. In one embodiment, an optical connector includes a ferrule including a first surface, a second surface, and at least one bore extending from the first surface. The optical connector further includes a waveguide support coupled to the ferrule. The waveguide support has a chip coupling surface. The optical connector further includes at least one waveguide disposed within the at least one bore of the ferrule and within the waveguide support such that a first end of the at least one waveguide is exposed at the first surface of the ferrule and a second end of the at least one waveguide is exposed at the chip coupling surface of the waveguide support.