Detachable SOC PCB Layout for Compact Vehicle Computing
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Solution Overview
Problem
The increasing demand for computing power in automated driving systems leads to larger and heavier computing apparatuses due to the need for more components on a single mainboard, necessitating the development of different system mainboards for varying computing power and driving levels.
Innovation Solution
The system on chip (SOC) is relocated to a detachable target PCB, which is connected to a heat dissipation component, allowing for interchangeable SOCs without changing the mainboard design, and the target PCB is arranged perpendicular to the mainboard to minimize space occupation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If more components are disposed on the mainboard to increase computing power, then the computing power is improved, but the area, size, and weight of the mainboard increase
Solution Approach 1:
The patent divides the computing apparatus into separate functional modules: the mainboard contains only essential components (power management, communication interfaces), while the SOC and its associated components are placed on a separate target PCB. This segmentation allows the mainboard to remain compact while the computing power is provided by the detachable target PCB, resolving the contradiction between computing power and mainboard area.
Solution Approach 2:
The SOC and its associated components are extracted from the mainboard and placed on a separate target PCB. This extraction removes the heavy computational components from the mainboard, allowing the mainboard to maintain a small area while the computing power is provided by the detachable target PCB module.
2Power
If more components are disposed on the mainboard to increase computing power, then the computing power is improved, but the weight of the computing apparatus increases
Solution Approach 1:
The computing apparatus is segmented into a lightweight mainboard and a separate target PCB module. The mainboard contains only essential lightweight components, while the target PCB holds the SOC and associated components. This segmentation allows the system to provide high computing power through the detachable module while keeping the main structure lightweight.
Solution Approach 2:
The heavy SOC and associated components are extracted from the mainboard and placed on a separate target PCB. This extraction allows the mainboard to remain lightweight while the computing power is provided by the detachable module, resolving the contradiction between computing power and overall weight.
3Adaptability or versatility
If different system mainboards are developed for different computing power and driving levels, then the adaptability is improved, but the device complexity increases
Solution Approach 1:
The mainboard is designed as a universal platform with standardized interfaces and essential components, capable of supporting different SOCs through the detachable target PCB. This universal design allows the same mainboard to serve multiple computing power requirements and driving levels, eliminating the need for multiple mainboard designs while maintaining adaptability.
Solution Approach 2:
The computing power configuration is made dynamic and interchangeable through the detachable target PCB. Users can dynamically select and replace different target PCBs with different SOCs based on specific computing power requirements, while the mainboard remains unchanged. This dynamic configuration provides adaptability without increasing mainboard design complexity.
Data Source
AI summary
An in-vehicle computing apparatus comprises a mainboard, a heat dissipation component, and a target printed circuit board (PCB). A system on chip (SOC) and a connection component are disposed on the target PCB. A side of the mainboard is attached to the heat dissipation component. The target PCB is located on a side of the heat dissipation component that faces away from the mainboard, and is detachably connected to the heat dissipation component by using the connection component.