Detachable Stamp Layer for Reliable Micro-LED Transfer Pickup
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Solution Overview
Problem
Conventional stamp tools for transporting mini-LEDs or micro-LEDs face challenges due to the risk of unintended adhesion to the wafer surface, leading to detachment from the transport head, especially as the size of the parts becomes smaller, requiring multiple types of transport heads and complicating the process.
Innovation Solution
A stamp tool design featuring a detachable stamp layer fixed to a support plate, which can be replaced on an adapter plate, along with a transport head that uses a combination of vacuum suction and a clamping mechanism to ensure secure attachment and detachment, allowing easy sharing and adaptation to different wafer types.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the stamp tool is designed with projections for transporting mini-LEDs or micro-LEDs, then the transport capability for small elements is improved, but the risk of unintended adhesion to the wafer surface increases causing detachment from the transport head
Solution Approach 1:
The stamp tool is divided into a stamp layer with projections for element pickup and a support plate structure. This segmentation allows the stamp layer to be optimized for element transport while the support plate provides structural stability and controlled detachment capability, resolving the contradiction between transport capability and attachment stability.
Solution Approach 2:
The patent modifies physical parameters such as the size, shape, and material properties of the stamp tool components. By adjusting these parameters, the adhesion characteristics are optimized to ensure reliable element pickup while preventing unintended strong adhesion to the wafer surface that would cause detachment.
2Adaptability or versatility
If multiple types of transport heads are prepared for different wafer types, then the adaptability to different specifications is improved, but the device complexity increases
Solution Approach 1:
The transport head is designed with a universal interface that can accommodate different stamp tools through the standardized support plate structure. This allows a single transport head to handle multiple wafer types by simply changing the stamp tool, eliminating the need for multiple specialized transport heads and reducing device complexity.
Solution Approach 2:
The stamp tool is nested within the transport head structure, with the stamp layer attached to the support plate which interfaces with the transport head. This nested configuration allows easy replacement and adaptation of stamp tools for different applications while maintaining a consistent outer transport head structure.
3Manufacturing precision
If the size of the stamp tool projections is reduced to match smaller LED elements, then the transport precision for mini-LEDs or micro-LEDs is improved, but the contact area with the wafer surface increases causing unintended adhesion
Solution Approach 1:
The stamp layer is designed with localized adhesive properties, where only specific regions or surfaces have adhesion characteristics suitable for element pickup. This local quality control ensures that adhesion occurs only where intended (at the projection-element interface) and not across the entire stamp tool-wafer contact area, preventing unintended adhesion.
Solution Approach 2:
The patent uses a stamp layer that can be replicated or replaced to match different element geometries. By creating precise copies of element shapes in the stamp projections, accurate transport is achieved without increasing overall contact area, as only the necessary projection surfaces contact the elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy sharing of transport heads, reduces the need for multiple tools, and ensures secure pickup and transfer of elements without leaving them on the substrate, improving efficiency and cost-effectiveness in manufacturing element arrays.
Implementation Method 1
a transport head being allowed to be detachably attached thereon
Implementation Method 2
the support plate is replaceably attached to the adapter plate by an adhesive layer
Implementation Method 3
a stamp layer having a portion allowing an transport object element to detachably adhere thereto
Data Source
AI summary
A stamp tool whose transport head can be easily shared, a transport device capable of allowing the stamp tool to easily pick up an transport object element disposed on a surface of a substrate from the substrate and transporting the element without being left on the substrate side, and an element array manufacturing method using the same.