Detachable Susceptor Ring Assembly for Thermal Stress Control
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Solution Overview
Problem
The existing susceptor designs for semiconductor wafer deposition face issues with thermal stresses and unwanted discharge of the carrier ring during epitaxial layer deposition, leading to inefficiencies in process control and increased production time due to the adhesion of the ring with dummy wafers.
Innovation Solution
A susceptor with a reversibly producible and detachable mechanical connection between the carrier ring and the susceptor plate, utilizing a bayonet lock mechanism, which prevents the ring from sticking to the wafer and allows for separate surface treatments and material selection to match thermal expansion coefficients, thereby reducing thermal stresses and preventing unwanted discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If a separate carrier ring is placed on the susceptor to buffer thermal stresses, then thermal stresses in the semiconductor wafer are reduced, but the ring adheres to dummy wafers and is inadvertently discharged from the process chamber
Solution Approach 1:
The susceptor is divided into two separate components: a susceptor plate and a carrier ring. The carrier ring can be detached from the susceptor plate, allowing independent handling and placement. This segmentation enables the ring to be removed before dummy wafer processing, preventing unwanted adhesion and discharge, while still providing thermal stress buffering during actual semiconductor wafer processing when the ring is attached.
2Temperature
If the carrier ring is made of silicon carbide with low mass, then thermal conductivity is improved, but the ring adheres strongly to dummy wafers during deposition
Solution Approach 1:
The system transitions from a static, permanently attached ring configuration to a dynamic, detachable configuration. The carrier ring can be attached or detached from the susceptor plate depending on the processing requirements. During dummy wafer deposition, the ring is detached to eliminate adhesion issues, while during actual semiconductor wafer processing, the ring is attached to provide thermal management benefits.
3Stress or pressure
If a permanently attached carrier ring is used on the susceptor, then thermal stress buffering is continuous, but the ring cannot be removed for process chamber cleaning and maintenance
Solution Approach 1:
The susceptor system is segmented into a susceptor plate and a separate carrier ring that can be detached. This allows the carrier ring to be removed from the process chamber for cleaning and maintenance without requiring removal of the entire susceptor assembly. The mechanical connection between the ring and plate can be quickly disassembled, facilitating efficient maintenance operations.
4Adaptability or versatility
If the carrier ring is detached and reattached multiple times, then adaptability to different processing needs is improved, but mechanical connection reliability may deteriorate
Solution Approach 1:
The mechanical connection features between the carrier ring and susceptor plate are designed and pre-configured to ensure reliable engagement. The connection mechanism includes precisely formed mechanical features that guarantee stable attachment when engaged, eliminating the need for complex alignment procedures during repeated attach-detach cycles. This preliminary design ensures that the mechanical connection maintains its reliability even after multiple cycles of attachment and detachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances process control and monitoring by preventing ring discharge, allowing for regular use of test wafers and enabling improved surface finishing and adaptability, thus reducing production time and improving the quality of semiconductor layers.
Implementation Method 1
the susceptor comprises a susceptor plate and a carrier ring for a substrate wafer, wherein the carrier ring is arranged on the susceptor plate
Implementation Method 2
allowing for separate surface treatments and material selection to match thermal expansion coefficients, thereby reducing thermal stresses
Implementation Method 3
there is a reversibly producible and detachable mechanical connection between the carrier ring and the susceptor plate
Data Source
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AI summary
Susceptor for a device for depositing a layer of semiconductor material onto a substrate disk by vapor deposition, wherein the susceptor comprises a susceptor plate and a support ring for a substrate disk, and the support ring is arranged on the susceptor plate, characterized in that a reversibly producible and detachable mechanical connection exists between the support ring and the susceptor plate.