Optical Transceiver Heat Sink Layout for Detachable Board Assembly
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Solution Overview
Problem
In network switch devices with copackaged optics, the increasing heat generation from both the ASIC and optical transceivers poses a challenge, requiring an effective heat dissipation mechanism that does not hinder the detachability of optical transceivers.
Innovation Solution
A board assembly design featuring a substrate with detachable optical transceivers and aligned heat dissipation mechanisms, utilizing liquid refrigerant channels and magnetic fixation, allowing easy detachment while maintaining heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation mechanism is provided for optical transceivers, then heat dissipation efficiency is improved, but ease of replacement deteriorates
Solution Approach 1:
The heat dissipation mechanism is segmented into a fixed base structure attached to the substrate and a detachable cover structure that can be removed with the optical transceiver. This segmentation allows the heat dissipation function to remain while enabling easy replacement of the transceiver by simply removing the cover portion.
Solution Approach 2:
The cover structure of the heat dissipation mechanism is extracted as a detachable component that can be removed together with the optical transceiver. This extraction allows the optical transceiver to be replaced without removing the entire heat dissipation mechanism, maintaining both heat dissipation efficiency and ease of replacement.
2Temperature
If heat dissipation mechanisms are provided for both ASIC and optical transceivers, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The substrate serves multiple functions: it provides mechanical support for mounting components, provides thermal pathways for heat dissipation from both the ASIC and optical transceivers, and provides electrical connections. This multi-functionality reduces device complexity while maintaining effective heat dissipation performance.
Solution Approach 2:
The heat dissipation mechanisms for the ASIC and optical transceivers are merged into a unified thermal management system where both components dissipate heat through the common substrate to heat dissipation structures, reducing overall system complexity compared to separate independent systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy and efficient detachment of optical transceivers without inhibiting heat dissipation, reducing manufacturing complexity and costs.
Implementation Method 1
a first heat dissipation mechanism (50) that includes a connector (51) adjacent to the heat dissipator (31a2) in the third direction and thermally connected to the heat dissipator (31a2)
Implementation Method 2
the first heat dissipation mechanism (50) may be configured to perform heat transfer with a liquid refrigerant
Implementation Method 3
the first heat dissipation mechanism (50) may be configured to perform heat transfer with a liquid refrigerant
Data Source
Figure 1
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Figure 3
AI summary
A board assembly includes a substrate that has a first surface facing in a first direction and a second surface facing in a direction opposite to the first direction on a side opposite to the first surface and to which an optical transceiver including a first electric interface and a heat dissipator that face in the direction opposite to the first direction are fixed; and a first heat dissipation mechanism that includes a connector adjacent to the heat dissipator in the first direction and thermally connected to the heat dissipator in a state where the optical transceiver is fixed to the substrate and that is fixed to the substrate and the board assembly is configured such that the optical transceiver is detachable in a state where the first dissipation mechanism is fixed to the substrate.