Detachable Transfer Plate for Micro Device Alignment
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Solution Overview
Problem
Current methods for transferring micro devices, such as wafer bonding, face challenges in cost reduction, time efficiency, and yield, especially when dealing with large-scale commercial applications involving millions of devices.
Innovation Solution
A method utilizing a detachable transfer plate and alignment assistive mechanisms to align, pick up, and transfer micro devices from a carrier substrate to a receiving substrate, with the detachable transfer plate being smaller, lighter, and simpler in structure, allowing for enhanced throughput and flexibility by reducing the need for complex alignment assistive mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional wafer bonding methods are used for transferring micro devices, then the transfer process can be completed, but the cost is high, time consumption is large, and yield is limited
Solution Approach 1:
The system segments the transfer process into distinct stages: picking up micro devices from the carrier substrate, transferring to the detachable transfer plate, and then placing on the receiving substrate. This segmentation allows each stage to be optimized independently, improving overall throughput while reducing total alignment time
Solution Approach 2:
The detachable transfer plate serves as an intermediary component between the carrier substrate and the receiving substrate. It temporarily holds the micro devices during transfer, enabling efficient batch processing and reducing the time required for direct alignment operations
2Manufacturing precision
If complex alignment assistive mechanisms are used to ensure precise alignment, then alignment precision is improved, but device complexity and operational complexity increase
Solution Approach 1:
The detachable transfer plate is designed as a universal component that can be detached and reattached to different alignment assistive mechanisms. This multi-functionality allows the same transfer plate to work with various alignment systems, reducing the need for complex, dedicated alignment mechanisms for each transfer operation
Solution Approach 2:
The system employs dynamic alignment where the detachable transfer plate can be quickly attached and detached from different alignment assistive mechanisms depending on the specific transfer task. This dynamic reconfiguration allows precise alignment when needed while maintaining operational simplicity through standardized interfaces
3Reliability
If a fixed transfer plate is used for micro device transfer, then the transfer process is stable, but flexibility and adaptability for different micro device types are reduced
Solution Approach 1:
The transfer system is segmented into a reusable aligning mechanism and disposable or interchangeable transfer plates. This segmentation allows the stable, complex alignment system to remain fixed while simpler transfer plates can be quickly changed to accommodate different micro device types, maintaining both reliability and flexibility
Solution Approach 2:
The detachable transfer plates can be designed with different parameters (size, shape, surface properties) to match different micro device types. By changing the transfer plate parameters rather than the entire alignment system, the maintain stability of the alignment mechanism while achieving adaptability for various micro devices
Data Source
AI summary
A method of transferring micro devices includes: aligning a detachable transfer plate to a carrier substrate with micro devices thereon by an alignment assistive mechanism which is detachably assembled with the detachable transfer plate; contacting the detachable transfer plate to the micro devices on the carrier substrate by the alignment assistive mechanism; picking up the micro devices from the carrier substrate; detaching the detachable transfer plate with the micro devices thereon from the alignment assistive mechanism; moving the detachable transfer plate with the micro devices thereon to be assembled to another alignment assistive mechanism above a receiving substrate to form a device transfer assembly; aligning the micro devices on the detachable transfer plate with the receiving substrate; and transferring the micro devices to the receiving substrate by the another alignment assistive mechanism through the detachable transfer plate.