Wafer-Handling End Effectors With Detachable Size Extensions

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Solution Overview

Problem

Conventional wafer-handling end effectors are limited in their ability to handle multiple wafer sizes, often requiring replacement and re-configuration of the robot when switching between different wafer sizes, leading to increased downtime and costs.

Innovation Solution

The development of wafer-handling end effectors with a blade and detachable surface extensions, allowing for selective attachment and separation, enabling the same end effector to handle various wafer sizes without the need for robot re-configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a conventional wafer-handling end effector is designed to handle a specific wafer size, then it can reliably handle that size, but it cannot handle other wafer sizes without replacement

Engineering Contradiction:

Improvewafer size compatibilityVSAvoidend effector configuration

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The end effector is divided into a base structure and interchangeable surface extensions. The surface extensions are separate components that can be attached to or removed from the base, allowing the same base to handle multiple wafer sizes by swapping only the extension portion rather than replacing the entire end effector.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The base structure of the end effector is designed as a universal platform that can accommodate different surface extensions for various wafer sizes. This allows a single base unit to perform multiple functions by interfacing with different extensions, eliminating the need for multiple dedicated end effectors.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If wafer-handling end effectors are replaced when switching wafer sizes, then proper handling is achieved, but robot re-teaching and downtime are required

Engineering Contradiction:

Improvewafer handling precisionVSAvoidrobot re-configuration time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

Multiple surface extensions for different wafer sizes are pre-configured and stored, ready for quick attachment. When a size change is needed, the appropriate pre-prepared extension can be rapidly swapped onto the base without requiring time-consuming robot re-teaching or complex reconfiguration procedures.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If wafer-handling end effectors contact the central region of the wafer, then they can handle various sizes, but they may damage integrated circuit devices

Engineering Contradiction:

Improvewafer size rangeVSAvoiddamage to integrated circuit devices

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The surface extensions are designed with contact points specifically positioned on the edge exclusion zone of the wafer, away from the central region containing integrated circuit devices. This localized contact approach allows versatile size handling while protecting sensitive areas from damage.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient and cost-effective handling of multiple wafer sizes by allowing seamless transition between different wafer sizes without robot re-teaching, reducing downtime and costs.

Implementation Method 1

The wafer-handling end effectors are configured to selectively lift a wafer from an upper surface thereof, via a pressure force

Methodology Applied

Scientific EffectPressure force: Pressure Increase

Data Source

PatentUS20250282063A1Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors

Publication Date: 2025.09.11 FORMFACTOR INC

AI summary

Wafer-handling end effectors, probe systems that include wafer-handling end effectors, and methods of utilizing wafer-handling end effectors are disclosed herein. The wafer-handling end effectors are configured to selectively lift a wafer from an upper surface thereof and include a blade, a surface extension, and an attachment mechanism. The blade defines a wafer-facing blade side and includes a gas distribution manifold in fluid communication with the wafer-facing blade side. The surface extension defines a wafer-facing extension side that extends away from the blade. The surface extension extends at least partially around the wafer-facing blade side and includes at least three projecting regions that project from the wafer-facing extension side and are configured to physically contact the upper surface of the wafer. The attachment mechanism is configured to permit selective attachment of the surface extension to the blade and selective separation of the surface extension from the blade.