Detachable Working Assemblies for Heat Dissipation in Electronic Devices
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Solution Overview
Problem
Existing electronic devices face challenges in efficiently dissipating heat from multiple working chips on circuit boards, leading to complex assembly and high maintenance costs, as well as reduced heat dissipation performance.
Innovation Solution
The electronic device incorporates a housing with detachable working assemblies, each comprising a circuit board with working chips and a radiator. Thermal conductive elements cover adjacent working chips and the substrate, and the radiator features a heat dissipation main body with bosses that align with the thermal conductive elements, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple working chips are arranged on a circuit board for parallel computing, then computing power requirements are met, but heat dissipation becomes complex and maintenance costs increase
Solution Approach 1:
The patent combines multiple working chips onto a single circuit board to form an integrated working assembly. This merging approach allows parallel computing capabilities while consolidating the heat dissipation system, as the radiator can serve all chips simultaneously rather than requiring separate cooling systems for each chip, thus reducing overall device complexity.
Solution Approach 2:
The radiator is designed as a universal heat dissipation component that serves multiple working chips simultaneously. The thermal conductive elements are configured to contact multiple chips, allowing a single radiator structure to perform the heat dissipation function for all chips in the assembly, reducing the number of components and simplifying maintenance.
2Power
If working chips are densely arranged to increase computing power, then parallel processing capability improves, but heat dissipation performance decreases
Solution Approach 1:
The patent employs thermal conductive elements with locally optimized configurations that contact specific regions of multiple working chips. The thermal conductive elements are positioned to make contact with heat-generating areas of the chips, providing targeted heat extraction from critical zones while maintaining dense chip arrangement for parallel processing capability.
Solution Approach 2:
Thermal conductive elements serve as intermediary components between the working chips and the radiator. These intermediaries efficiently transfer heat from the chip surfaces to the radiator structure, enabling effective heat dissipation even when chips are densely arranged, thus maintaining both high computing power and good thermal performance.
3Ease of repair
If working assemblies are made detachable for easier maintenance, then maintenance complexity reduces, but assembly stability may be compromised
Solution Approach 1:
The patent divides the electronic device into modular working assemblies, each comprising a circuit board with working chips and an integrated radiator. This segmentation allows individual assemblies to be detached and replaced independently for maintenance purposes, significantly improving ease of repair while maintaining system reliability through standardized connection interfaces that ensure stable reassembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation performance by efficiently transferring heat from working chips and the substrate to the radiator, reducing maintenance complexity and costs, and ensuring stable operation of the electronic device.
Implementation Method 1
a plurality of thermal conductive elements, wherein each thermal conductive element covers at least two adjacent working chips and a region between the adjacent working chips
Implementation Method 2
the housing encloses a heat dissipation air duct, the circuit board and the radiator are both provided in the heat dissipation air duct, and the heat dissipation direction is an air direction of the heat dissipation air duct
Implementation Method 3
the radiator includes a heat dissipation main body and heat dissipation fins
Data Source
AI summary
An electronic device, comprising: a housing; working assemblies mounted in the housing, wherein each working assembly comprises a circuit board and a radiator, the circuit board comprising a substrate and a plurality of working chips provided on the substrate; and the working assemblies are detachably mounted within the housing; a control board connected to the circuit board; and a power source configured to supply power to the circuit board.