De-Tape Tool for Clean Sacrificial Substructure Removal
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Solution Overview
Problem
The reliable removal of sacrificial substructures from support structures in semiconductor manufacturing is challenging due to adhesive attachment, leading to incomplete detachment and inefficiencies in waste management.
Innovation Solution
A method involving the use of a barrier, such as a non-adhesive material like plastic or paper, is applied to cover the sacrificial substructure, followed by a sacrificial substructure remover with puncture pins to securely attach and detach the substructure from the support structure, ensuring complete removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive material is used to attach the sacrificial substructure to the support structure, then the substructure remains securely attached during semiconductor manufacturing processes, but the substructure becomes difficult to remove completely without leaving residue
Solution Approach 1:
The adhesive attachment system is segmented into two distinct layers: a permanent adhesive layer that provides strong initial bonding between the sacrificial substructure and support structure, and a removable adhesive layer that enables clean detachment. This segmentation allows the system to simultaneously achieve strong attachment during manufacturing and easy removal afterward, resolving the contradiction between attachment strength and removal ease.
2Reliability
If strong adhesive is used to secure the sacrificial substructure, then the substructure remains stable during processing, but complete detachment becomes unreliable and inefficient
Solution Approach 1:
The adhesive system is divided into permanent and removable layers with distinct functions. The permanent layer ensures reliable attachment during processing, while the removable layer enables efficient detachment. This segmentation resolves the contradiction between attachment reliability and removal efficiency by distributing these conflicting requirements to different layers.
Solution Approach 2:
The adhesive layers differ in their adhesive parameters - the permanent layer has high adhesive strength for reliable attachment, while the removable layer has controlled adhesive properties that allow complete detachment. By changing adhesive parameters between layers, the system achieves both reliable processing and efficient removal.
3Ease of manufacture
If the sacrificial substructure is firmly attached to the support structure, then the support structure can be reused, but incomplete removal leads to waste management inefficiencies
Solution Approach 1:
The segmented adhesive system allows the sacrificial substructure to be firmly attached during manufacturing (enabling support structure reuse) while ensuring complete removal without residue (eliminating waste). The removable adhesive layer specifically addresses the waste prevention requirement by designing adhesive properties that facilitate clean detachment.
Solution Approach 2:
The system is designed to enable complete recovery of the support structure by ensuring the sacrificial substructure and adhesive are fully removed without residue. The removable adhesive layer facilitates this complete discarding of the sacrificial component and recovery of the support structure for reuse, preventing material loss and waste.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable and efficient detachment of the sacrificial substructure, facilitating waste recycling and reuse of support structures.
Implementation Method 1
A sacrificial substructure remover includes a puncture plate with a plurality of puncture pins extending from one side of the puncture plate toward an opposite side of the puncture plate
Implementation Method 2
the puncture plate is moved through an opening in the support structure, wherein moving the puncture plate detaches the sacrificial substructure from the support structure
Data Source
AI summary
A method of removing a sacrificial substructure from a support structure is disclosed. The method includes receiving the support structure, where the support structure has the sacrificial substructure connected thereto, the sacrificial substructure having functioning electrical devices removed therefrom. The method also includes applying a barrier to the sacrificial substructure, puncturing the sacrificial substructure with a puncture plate to secure the sacrificial substructure to the puncture plate, and detaching the sacrificial substructure from the support structure by moving the puncture plate with respect to the support structure.