Detaping Machine for Wafer Tape Removal
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Solution Overview
Problem
In the wafer dicing process, efficiently removing tape from a reusable frame after identifying and separating good and bad dies is challenging, requiring an efficient method to collect and recycle the tape and bad dies while preventing tape damage.
Innovation Solution
A detaping machine with a carrier, die identify module, cover layer supplying module, and detaping module is used to transport, identify, and remove the tape from the frame, employing a combination of elastic pressing devices and a detaping head to separate the tape without tearing, and a cover layer to prevent sticking, facilitating efficient collection and recycling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual detaping is used, then tape can be removed from frame, but detaping efficiency is low and labor-intensive
Solution Approach 1:
The detaping head automatically performs the detaping operation by pressing and moving along the tape, eliminating the need for manual intervention. The system serves itself by using the frame's own structure as a guide for the detaping head's movement path
Solution Approach 2:
The patent replaces manual mechanical detaping with an automated mechanical system consisting of a detaping head mounted on a movable platform, which is driven by a driving mechanism to automatically press and slide along the tape, achieving automated detaping
2Speed
If detaping force is increased to remove tape quickly, then detaping speed improves, but tape may tear or damage
Solution Approach 1:
The detaping head moves periodically along the tape in a controlled manner, combining pressing force with gradual movement. This periodic pressing and moving action allows the tape to be detached progressively without sudden force that could cause tearing
Solution Approach 2:
The pressing force is applied locally at the contact point between the detaping head and the tape, rather than uniformly across the entire tape. This localized pressing allows controlled detachment while maintaining tape integrity in non-contact areas
3Device complexity
If tape is removed without cover layer protection, then detaping process is simpler, but tape sticking occurs
Solution Approach 1:
A cover layer is introduced as an intermediary between the detaping head and the tape surface. This cover layer prevents direct contact and sticking while allowing the detaping operation to proceed, serving as a protective mediator that facilitates smooth tape removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The machine enables efficient and automatic removal of tape from frames, reduces the risk of tape damage, allows for accurate identification of bad dies, and facilitates the recycling of frames and packaging of bad dies for return to the manufacturing company.
Implementation Method 1
a detaping module (140) which includes a first pressing part and a second pressing part, wherein the periphery area of the tape is adapted to be pressed by the first pressing part, and the wafer mounting area of the tape is adapted to be pressed by the second pressing part
Implementation Method 2
the wafer mounting area of the tape is adapted to be pressed by the second pressing part until the tape is removed from the frame
Data Source
AI summary
A detaping machine is adapted for removing a tape from a frame, the tape includes a wafer mounting area and a periphery area surrounding the wafer mounting area. The detaping machine includes a carrier and a detaping module. The carrier is for supporting the tape and the frame. The detaping module includes an elastic pressing device and a detaping head, wherein the periphery area of the tape is adapted to be pressed by the elastic pressing device, and the wafer mounting area of the tape is adapted to be pressed by the detaping head. A detaping method is further provided.