Detection Device Substrate Polishing via Intermediary Film
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Solution Overview
Problem
Existing detection devices, such as those using photosensors, face challenges in achieving a thinner form factor due to substrate damage during polishing processes, particularly when formed on a single array substrate without a color filter substrate.
Innovation Solution
A detection device is designed with a substrate, sensor elements, an insulating film covering the sensor elements, and a first projection on the insulating film, allowing for bonding of substrates with facing projections to facilitate polishing without damaging the substrate surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the detection device is formed on a single array substrate without a color filter substrate, then the device can be thinner, but the substrate may be damaged in the polishing process
Solution Approach 1:
A polishing protection film is introduced as an intermediary layer between the array substrate and the polishing cloth. This film serves as a mediator that absorbs the mechanical stress of polishing, preventing direct contact between the polishing cloth and the fragile array substrate, thereby avoiding substrate damage while enabling the thinning process
Solution Approach 2:
The polishing protection film is formed on the array substrate before the polishing process begins. This preliminary action prepares the substrate by providing a protective layer that will prevent damage during the subsequent polishing operation, allowing the device to be thinned safely
2Device complexity
If the detection device includes no color filter substrate and is formed of a single array substrate, then the device structure is simplified, but the array substrate is difficult to polish without damage
Solution Approach 1:
The polishing protection film acts as a mediator that enables the polishing process to be performed on the simplified single-substrate structure without causing damage. It bridges the gap between the need for device simplification and the requirement for manufacturability through polishing
Solution Approach 2:
The polishing protection film provides beforehand cushioning by absorbing polishing forces before they can reach and damage the array substrate. This cushioning effect makes the polishing process feasible for the simplified device structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the manufacturing of thinner detection devices while minimizing substrate damage during polishing and separation, reducing manufacturing costs and maintaining detection accuracy.
Implementation Method 1
an insulating film provided above the substrate so as to cover the sensor elements
Implementation Method 2
bonding together the pair of substrates
Data Source
AI summary
A method for manufacturing a detection device, the detection device comprising a substrate, a plurality of sensor elements arranged on a first principal surface of the substrate, and an insulating film provided above the substrate so as to cover the sensor elements, and the method comprising: causing the first principal surfaces of a pair of the substrates on each of which the sensor elements, the insulating film, and a first projection projecting from a surface of the insulating film are formed to face each other, and bonding together the pair of the substrates; and polishing a second principal surface of each of the pair of the substrates on a side opposite to the first principal surface in a state where the pair of the substrates are bonded together.