Radioactive Ray Detector Cooling Structure for Low Thermal Noise
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Solution Overview
Problem
CMOS and CCD detectors for radioactive rays face reduced detection accuracy due to cross-talk and secondary electrons, increased power consumption leading to heat generation, and insufficient cooling which affects sensitivity and resolution.
Innovation Solution
A detector structure with a first member for detecting radioactive rays, a second member for signal processing, a third member with openings for support, and a fourth member with high thermal conductivity connected via a thermal conductive member and penetration part to enhance cooling, reducing thermal resistance and improving heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling unit is provided on the backside of the detector, then cooling performance is improved, but radioactive rays may transmit through the thinned detection region to the backside and generate reflection or scattering
Solution Approach 1:
The backside structure is segmented into multiple functional layers: a first cooling unit with first cooling holes, a second cooling unit with second cooling holes, and a reflective layer. This segmentation allows different regions to serve different functions - cooling while minimizing ray interaction that causes reflection or scattering.
Solution Approach 2:
The patent introduces intermediary structures between the detection region and the cooling units, including through-holes that extend from the backside surface through the support structure to the detection region. These intermediaries facilitate heat transfer while maintaining mechanical support and minimizing harmful reflections.
2Measurement precision
If the semiconductor layer is thinned to suppress cross-talk and secondary electrons, then detection accuracy is improved, but cooling performance deteriorates due to reduced thermal mass
Solution Approach 1:
The patent compensates for the reduced thermal mass in the thinned semiconductor layer by extending cooling structures into the support structure dimension. The through-holes and cooling units in the support structure provide additional thermal pathways that compensate for the reduced thermal capacity of the thinner detection region.
Solution Approach 2:
The support structure is designed as a composite system combining the semiconductor layer with the support structure having integrated cooling units. This composite design allows the support structure to provide both mechanical support and thermal management functions, compensating for the reduced thermal mass of the thinned detector.
3Productivity
If the number of pixels and driving speed are increased, then productivity is improved, but power consumption and heat quantity increase
Solution Approach 1:
The cooling system is segmented into multiple cooling units distributed across the backside surface, with each unit handling heat from specific pixel regions. This segmentation allows efficient heat distribution across high pixel-count detectors while maintaining high driving speeds.
Solution Approach 2:
The patent employs multiple cooling units that replicate the cooling function across different regions of the detector backside. This copying of cooling functionality ensures that heat generated by high-speed operation in any region can be efficiently dissipated without compromising overall detector performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively cools the detector, reduces thermal noise, and enhances sensitivity and resolution by minimizing thermal resistance and heat dissipation paths.
Implementation Method 1
a fourth member having a second opening overlapping at least a part of the first region in the planar view and having higher thermal conductivity than the third member; and a penetration part provided in a third region overlapping the fourth member outside a second region on which the second member is projected in the planar view, connected to the fourth member
Data Source
AI summary
A detector includes: a first member that detects a radioactive ray; a second member located around the first member; a third member having a first opening overlapping at least a part of a first region on which the first member is projected in a planar view including the first member and the second member; a fourth member having a second opening overlapping at least a part of the first region in the planar view and having higher thermal conductivity than the third member; and a penetration part provided in a third region overlapping the fourth member outside a second region on which the second member is projected in the planar view, connected to the fourth member, connected to the second member via a thermal conductive member, and having higher thermal conductivity than the third member.