Detector Element Inspection via Non-Contact Signal Coupling
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Solution Overview
Problem
In semiconductor IC manufacturing, detecting and identifying micro and nano-scale defects on substrates is challenging due to the complexity of the process and the need for high throughput, which existing pattern inspection tools with charged particle beams struggle to achieve without affecting detector characteristics or requiring complex setups.
Innovation Solution
A detector inspection device and method that includes a coupler positioned proximate to a detector element and a controller applying a stimulating signal to interrogate the detector, allowing for verification of its functionality without direct contact and minimizing interference, using a shield electrode or verification element to stimulate a response signal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a detector is checked using conventional methods, then detector functionality can be verified, but it affects detector characteristics and requires complex setup
Solution Approach 1:
A coupler is introduced as an intermediary component between the signal particle source and the detector. The coupler receives signal particles and transmits them to the detector, enabling verification without direct contact that would affect detector characteristics. This mediator allows the detector to be tested while maintaining its operational characteristics intact.
Solution Approach 2:
The system creates a test signal particle stream that copies the characteristics of actual signal particles from the charged particle beam. This test stream is directed through the coupler to the detector, allowing verification of detector response to signal particles without requiring the complex full inspection setup.
2Reliability
If a detector is checked using conventional methods, then detector functionality can be verified, but detector characteristics are affected
Solution Approach 1:
The coupler serves as a protective intermediary that isolates the detector from direct exposure to test conditions. By routing test signal particles through the coupler rather than directly at the detector, the detector's sensitive characteristics are protected while still allowing functionality verification through the coupler's transmission path.
Solution Approach 2:
The detector can be verified through the coupler system without requiring external complex verification equipment. The coupler enables the detector to essentially test itself by transmitting test signal particles that generate detectable responses, allowing self-verification while maintaining detector integrity.
3Productivity
If charged particle beam inspection is used for high throughput, then inspection speed increases, but difficulty in detecting micro and nano-scale defects increases
Solution Approach 1:
The inspection system divides the detection task into multiple detector elements arranged in arrays, with each element responsible for detecting signal particles from specific beam spots. This segmentation allows parallel processing of multiple areas simultaneously, maintaining high throughput while each individual detector element can resolve fine micro and nano-scale features through optimized signal particle detection.
Solution Approach 2:
The system replaces direct mechanical/optical imaging of micro and nano defects with indirect detection through signal particle emission. Instead of attempting to directly image extremely small features, the charged particle beam interacts with the sample to emit signal particles that carry information about the sample structure, which is then detected and processed to identify defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and non-invasive verification of detector elements, ensuring accurate detection of signal particles and maintaining detector performance, thus improving defect detection efficiency and reducing operational complexity in IC manufacturing.
Implementation Method 1
a device controller configured to apply a stimulating signal to the coupler to stimulate a response signal in the detector for interrogating at least part of the detector
Implementation Method 2
The interactions between the material structure at the probing spot and the landing electrons from the beam of electrons cause signal particles, e.g. electrons, to be emitted from the surface, such as secondary electrons, backscattered electrons, or Auger electrons
Implementation Method 3
a shield electrode positioned proximate to the detector element
Data Source
AI summary
The embodiments of the present disclosure provides a detector inspection device for interrogating at least part of a detector comprised in a charged particle-optical assessment apparatus, the detector inspection device comprising: a coupler configured to be positioned proximate to a detector element of a detector; and a device controller configured to apply a stimulating signal to the coupler to stimulate a response signal in the detector for interrogating at least part of the detector.