Detector Pack with Nested ASIC Interposer for Noise Reduction
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Solution Overview
Problem
Existing medical X-ray CT apparatuses face challenges in suppressing noise due to the long electrical distance between the optical semiconductor element and the ASIC, which affects image processing and quality.
Innovation Solution
The detector pack design includes interposers with concave portions on the substrate to position ASICs closer to the optical semiconductor elements, reducing the electrical distance and noise, while maintaining a compact size and allowing for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the ASIC is directly provided on the second main surface of the first substrate, then the electrical distance between the optical semiconductor element and the ASIC is shortened, but the detector pack size increases and cooling efficiency decreases
Solution Approach 1:
The second substrate is inserted into a recess formed in the first substrate, creating a nested structure where the ASIC is positioned closer to the optical semiconductor element without increasing the overall detector pack volume. This nesting approach allows the ASIC to be electrically connected to the optical semiconductor element through the flexible substrate while maintaining a compact form factor.
Solution Approach 2:
Instead of placing the ASIC laterally adjacent to the optical semiconductor element on the same substrate plane, the invention utilizes the vertical dimension by creating a recess in the first substrate and inserting the second substrate with the ASIC into this recess. This vertical arrangement shortens the electrical distance while maintaining a compact horizontal footprint.
2Reliability
If the ASIC is directly provided on the second main surface of the first substrate, then the electrical distance between the optical semiconductor element and the ASIC is shortened, but heat dissipation becomes difficult
Solution Approach 1:
The recess structure allows the second substrate with the ASIC to be nested within the first substrate, creating pathways for heat to conduct from the ASIC through the flexible substrate and into the first substrate's thermal management structures. This nested configuration improves heat dissipation efficiency compared to a flat mounting arrangement.
Solution Approach 2:
The flexible substrate serving as an electrical connection medium also acts as a thermal conduction pathway, transferring heat from the ASIC to the first substrate where thermal management can be more effectively implemented. The recess structure facilitates this thermal intermediary function by positioning the ASIC in closer proximity to the heat dissipation structures.
3Productivity
If more ASICs are provided to increase processing capacity, then image processing capability improves, but the detector pack size increases
Solution Approach 1:
Multiple ASICs are mounted on the second substrate in a compact arrangement, utilizing the vertical space created by the recess structure. This merging of multiple processing units into a single nested configuration allows increased image processing capability without proportionally increasing the detector pack volume.
Solution Approach 2:
The recess structure provides additional vertical space that allows multiple ASICs to be stacked or arranged in three dimensions rather than being limited to a two-dimensional plane. This enables higher processing capacity within the same horizontal footprint by utilizing the depth dimension of the recess.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces noise, enables efficient image processing, and allows for a higher density of ASICs without increasing the detector pack's size, while also facilitating efficient cooling.
Implementation Method 1
an optical semiconductor element which is provided on a first main surface of the first substrate... converts an X-ray into an electrical signal
Implementation Method 2
a scintillator which is provided on the optical semiconductor element
Data Source
AI summary
According to an embodiment, a detector pack includes a first substrate, an X-ray detection unit, a second substrate, and a data acquisition device. The first substrate includes a first main surface and a second main surface. The X-ray detection unit is provided in the first main surface, converts an X-ray into an electrical signal, and outputs the electrical signal. The second substrate includes a third main surface and a fourth main surface and is disposed in a posture of making the third main surface face the second main surface. The data acquisition device is provided in at least any one of the third main surface and the fourth main surface.