Detector Unit Electronics Sub-Assembly Integration
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Solution Overview
Problem
Current radiation imaging modalities face challenges in efficiently converting radiation into digital signals for accurate imaging, particularly in high-density applications where dense objects attenuate radiation, leading to suboptimal image quality and requiring large detector arrays with complex modular designs.
Innovation Solution
A detector unit comprising an electronics sub-assembly with an analog-to-digital converter enclosed in a molding compound, electrically coupled to a photodetector array, and a substrate, facilitating efficient signal processing and modular design for radiation imaging modalities, enabling effective radiation detection and image reconstruction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If detector arrays use modular design with multiple detector units, then ease of manufacture and adaptability improve, but device complexity increases due to coupling elements and substrate connections
Solution Approach 1:
The patent combines the A/D converter, substrate, and coupling elements into an integrated electronics sub-assembly that is pre-packaged with the photodetector array. This merging of components into a single modular unit simplifies the overall assembly process while maintaining the necessary electrical connections, resolving the contradiction between modular ease of manufacture and device complexity.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides electrical coupling between the photodetector array and A/D converter, structural support for the electronics sub-assembly, and a mounting interface for coupling to other detector units. This multi-functionality reduces the number of separate components needed, thereby reducing device complexity while preserving modular manufacturability.
2Measurement precision
If detector arrays increase the number of detector cells for high-density applications, then measurement precision improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent divides a large-scale detector array into multiple identical detector units, each containing a manageable number of photodetectors (e.g., 64x64 or 128x128 elements). Each unit is independently manufactured and tested, then assembled into larger arrays. This segmentation enables high measurement precision through large total detector counts while keeping individual manufacturing tasks manageable and reducing overall system complexity.
Solution Approach 2:
The patent allows the photodetector array dimensions and A/D converter configuration to be adjusted as parameters to match different application requirements. By changing these parameters rather than redesigning the entire system, the patent achieves high measurement precision for different scenarios while maintaining a standardized, less complex base design that can be scaled.
3Reliability
If detector units are self-contained with integrated electronics, then ease of operation and reliability improve, but manufacturing precision requirements increase
Solution Approach 1:
The electronics sub-assembly is pre-packaged and tested as a complete functional unit before being integrated into the final detector array. The A/D converter, substrate, and coupling elements are assembled and verified to work together correctly in advance. This preliminary action ensures reliable functionality while allowing manufacturing precision to be achieved in controlled, smaller-scale assembly steps rather than in the final complex integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances image quality by efficiently converting radiation into digital signals, supporting large detector arrays, and enabling flexible modular designs for various imaging applications, including CT systems and security scanners.
Implementation Method 1
respective detector cells, respectively configured to convert detected radiation into electrical signals
Implementation Method 2
an analog-to-digital (A/D) converter enclosed within a molding compound
Data Source
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AI summary
Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. The electronics sub- assembly comprises electronic circuitry, embedded within a molding compound, configured to digitize analog signals yielded from the radiation detection sub- assembly and/or to otherwise process such analog signals. The electronics sub- assembly also comprises a substrate, such as a printed circuit board, configured to route signals between the electronic circuitry and a photodetector array of the radiation detection sub-assembly and/or to route signals between the electronic circuitry and digital processing components, such as an image generator, for example.