Developer Alcohol Concentration Control for Semiconductor Pattern Defects

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Solution Overview

Problem

Current methods for forming patterns in semiconductor production and other photoapplication lithography processes face challenges in achieving comprehensive excellent performance, particularly in reducing foreign matter sticking defects.

Innovation Solution

A method involving the formation of a chemically amplified resist composition into a film, exposure to light, and development with a developer containing an organic solvent, specifically an alcohol compound at a controlled concentration, to suppress foreign matter sticking defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional developers are used for pattern formation, then development process is simple, but foreign matter sticking defects occur on pattern surface

Engineering Contradiction:
Improvepattern qualityVSAvoiddeveloper composition complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies parameter changes by precisely controlling the alcohol compound concentration in the developer to less than 500 ppm. This quantitative parameter adjustment modifies the developer's chemical properties to prevent foreign matter sticking while maintaining effective resist dissolution, thereby improving pattern quality without requiring complex additional components

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces an intermediary substance (alcohol compound) at controlled concentrations to mediate between the developer and foreign matter on the pattern surface. This intermediary prevents foreign matter adhesion by modifying surface interactions during development, resolving the contradiction between simple process and defect prevention

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If developer contains high alcohol compound content, then foreign matter sticking is suppressed, but resist dissolution uniformity deteriorates

Engineering Contradiction:
Improveforeign matter stickingVSAvoidresist dissolution uniformity
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The patent resolves this contradiction through precise parameter control, setting the alcohol compound concentration to less than 500 ppm. This optimized parameter level achieves the dual benefit of suppressing foreign matter sticking while maintaining uniform resist dissolution, avoiding the detrimental effects of higher alcohol concentrations

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively reduces foreign matter sticking defects by ensuring uniform dissolution of the resist in unexposed regions and preventing foreign matter from adhering to the pattern surface.

Implementation Method 1

an acid generator contained in exposed areas is decomposed upon exposure to light, such as an excimer laser, electron beams or an extreme ultraviolet light, to thereby generate an acid

Methodology Applied
Scientific EffectPhotochemical decomposition: Photodissociation

Implementation Method 2

developing the exposed film with a developer containing an organic solvent... ensuring uniform dissolution of the resist in unexposed regions

Methodology Applied
Scientific EffectSolvation: Solvation

Data Source

PatentUS9897922B2Method of forming pattern and developer for use in the method
Publication Date: 2018.02.20 FUJIFILM CORP
  • US9897922B2 patent drawing
  • US9897922B2 patent drawing
  • US9897922B2 patent drawing

AI summary

Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing an organic solvent, wherein the developer contains an alcohol compound (X) at a content of 0 to less than 500 ppm based on the total mass of the developer.