Developing Nozzle Horizontal Wash System
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Solution Overview
Problem
In semiconductor and flat panel display processing, the existing developing solution supply methods often result in developing defects and line width defects due to solution dripping from the nozzle during return strokes, and require unnecessary time extensions as the nozzle needs to be moved back to the washing tank to prevent dripping.
Innovation Solution
A method and apparatus where the developing nozzle is separated from one washing tank, moved horizontally to another washing tank to supply the solution, and then washed within that tank, eliminating the need for return strokes and subsequent cleaning steps, with a movable cup for substrate cleaning and drying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the nozzle is moved back to the washing tank after supplying developing solution, then the developing solution can be prevented from dripping onto the substrate, but the processing time is increased and the nozzle may still transfer adhered solution onto the substrate
Solution Approach 1:
The harmful function of the nozzle (dripping developing solution during return stroke) is extracted and eliminated by removing the return stroke motion entirely. The nozzle is positioned to supply solution only during the forward stroke toward the substrate, and remains stationary or is repositioned only when needed for solution supply, eliminating the time-consuming and harmful return motion to the washing tank.
Solution Approach 2:
The nozzle is preliminarily positioned and prepared to supply developing solution only when needed (during forward stroke), rather than continuously moving back and forth. The system prepares the nozzle in advance at the optimal position for solution supply, eliminating unnecessary motions that cause both time loss and potential defects.
2Productivity
If the nozzle continuously moves to supply developing solution, then the developing process can be completed faster, but developing defects and line width defects occur due to solution dripping during return strokes
Solution Approach 1:
The harmful return stroke motion that causes solution dripping and line width defects is extracted and removed from the process. The nozzle operates only in the forward direction toward the substrate, supplying solution precisely when and where needed, eliminating the source of manufacturing defects while maintaining high productivity.
Solution Approach 2:
The nozzle motion is made dynamic and adaptive, moving only when and where solution supply is needed, rather than following a fixed back-and-forth pattern. The system dynamically adjusts the nozzle position and motion to match the actual processing requirements, improving both speed and precision.
Data Source
AI summary
In an apparatus for performing a substrate developing process, a first washing tank and a second washing tank are disposed on both sides of a substrate support section for supporting the substrate opposite to each other to wash a developing nozzle. The developing nozzle moves in a horizontal direction from the first washing tank toward the second washing tank and supplies a developing solution onto the substrate in the meantime. After supplying the developing solution, the developing nozzle is received in the second washing tank, and the developing solution adhered to the developing nozzle is removed by a washing solution in the second washing tank.