Device Carrier Insulation with Form-Fitting Segmented Parts

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Solution Overview

Problem

Existing device carriers for attaching electrical devices to building walls face challenges in efficient insulation due to thermal bridges and complex installation processes, especially when dealing with varying wall structural conditions and irregular device carrier contours.

Innovation Solution

A device carrier with a modular, two-part insulation system that fits snugly around the carrier's circumference, allowing for easy assembly and adjustment to different structural conditions without the need for additional fasteners, and can be easily detached for maintenance or reconfiguration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If insulation material is used to surround the device carrier, then thermal insulation effectiveness is improved, but gaps form around the device carrier creating thermal bridges

Engineering Contradiction:
Improvethermal insulation effectivenessVSAvoidinsulation installation complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

An intermediate insulation component is introduced that bridges the gap between the device carrier and the wall insulation. This intermediate component fits around the device carrier and connects to the wall insulation, eliminating thermal bridges without requiring complex custom-cut insulation materials.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The insulation system is divided into separate modular components: wall insulation panels and device carrier insulation components. These segmented components can be independently installed and assembled, simplifying the overall insulation process while maintaining thermal effectiveness.

Inventive Principle:
Principle #1Segmentation

2Loss of energy

If foam is used to fill gaps between device carrier and insulation material, then insulation effectiveness is improved, but assembly time and material costs increase

Engineering Contradiction:
Improveinsulation effectivenessVSAvoidassembly time
Core Design Contradiction:
Loss of energyVSLoss of time

Solution Approach 1:

The insulation components are pre-formed with precise dimensions and shapes that fit together without requiring on-site foam filling. The insulation panels and device carrier insulation components are manufactured beforehand to match the specific geometry, eliminating the need for time-consuming foam application and curing processes.

Inventive Principle:
Principle #10Preliminary action

3Loss of energy

If insulation material is cut to fit around device carrier, then insulation effectiveness is improved, but preparation time and complexity increase

Engineering Contradiction:
Improveinsulation effectivenessVSAvoidinsulation preparation ease
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

The insulation components are designed as standardized copies that fit common device carrier geometries. Rather than custom-cutting insulation for each unique device carrier shape, pre-fabricated insulation components with standard dimensions and connection features are used, dramatically simplifying installation.

Inventive Principle:
Principle #26Copying

4Adaptability or versatility

If device carrier has complex outer contour, then device mounting flexibility is improved, but insulation material preparation becomes complicated

Engineering Contradiction:
Improvedevice mounting flexibilityVSAvoidinsulation preparation complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The insulation system employs local adaptation through modular components that can be selectively applied to different portions of the device carrier. Each insulation component is designed to fit specific local geometries (flat surfaces, curved surfaces, protrusions), allowing the system to accommodate complex overall contours while maintaining simple local installation procedures.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides efficient insulation by eliminating thermal bridges and simplifying the installation process, reducing construction costs and time, while allowing for flexible adaptation to various device carrier configurations and wall insulation systems.

Implementation Method 1

at least two-part insulating material which surrounds the device carrier on the circumference between the base surface and the front side

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentEP2597216B1Device holder with insulation
Publication Date: 2016.03.16 AGRO INC
  • EP2597216B1 patent drawingFigure 1
  • EP2597216B1 patent drawingFigure 2
  • EP2597216B1 patent drawingFigure 3~4

AI summary

A mounting bracket for attaching a device to a building wall comprises a base element (4) with a base surface (7) for attachment to the building wall and a device holder (6, 6', 6") for receiving a device, in particular an electrical device, with a front face (8) opposite the base surface (7). At least two-part insulation is provided, which surrounds the mounting bracket (1) between the base surface (7) and the front face (8). At least a first insulation part (2; 23) and a second insulation part (3; 24) are provided, each having an inner contour corresponding to a portion of a circumferential contour of the mounting bracket (1), and which fit snugly against the mounting bracket (1) and against each other.