Portable Device Case Base With Conductive Cooling Sections
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Solution Overview
Problem
Conventional case materials for portable electronic devices have low thermal conductivity, limiting their ability to effectively manage heat dissipation.
Innovation Solution
The use of thermally conductive materials such as aluminum, copper, brass, carbon fiber, and steel alloys with high thermal conductivity, combined with air movers and corrugated fins, to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional case materials are used, then device portability and ease of manufacture are maintained, but thermal conductivity is insufficient for effective heat dissipation
Solution Approach 1:
The base assembly utilizes composite construction combining thermally conductive materials (aluminum, copper, brass, carbon fiber, or steel alloys with thermal conductivity ≥30 W/m.K) with conventional case materials. This allows the thermal management portion to use high-performance materials while the rest of the case maintains ease of manufacture and cost-effectiveness.
Solution Approach 2:
The base is divided into a first portion with high thermal conductivity (≥30% of base interior) and other portions with conventional materials. This segmentation allows targeted thermal management where needed while maintaining overall manufacturing simplicity and cost efficiency.
2Temperature
If high thermal conductivity materials are used throughout the entire base, then heat dissipation is maximized, but manufacturing complexity and cost increase
Solution Approach 1:
The base assembly implements local quality by providing high thermal conductivity (≥30 W/m.K) specifically in the first portion where heat dissipation is most critical, while other portions use conventional materials. This targeted approach maximizes thermal performance where needed without unnecessarily complicating the entire base structure.
3Temperature
If the thermally conductive portion occupies a larger volume of the base, then heat dissipation efficiency improves, but device weight and material cost increase
Solution Approach 1:
The patent specifies that the first portion with high thermal conductivity (≥30 W/m.K) occupies at least 30% of the base interior volume, with implementations ranging from 30% to 75% or more. This parameter range allows optimization between heat dissipation efficiency and device weight, enabling designers to select the appropriate volume fraction based on specific thermal management requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly improves heat dissipation capabilities of portable electronic devices, ensuring efficient thermal management and maintaining device performance.
Implementation Method 1
the base includes a first portion having a thermal conductivity of at least 30 W/m.K
Implementation Method 2
at least one air mover positioned adjacent the first side
Implementation Method 3
the base includes an exterior with a plurality of corrugated fins extending between the first side and the third side
Data Source
AI summary
Systems involve implementations such as a case system including (I) a front assembly including (A) a first side, (B) a second side extending perpendicular with respect to the first side, (C) a third side extending parallel with respect to the first side, (D) a fourth side extending parallel with the respect to the second side, and (E) a base extending perpendicular to and having an interior extending between the first side, the second side, the third side, and the fourth side, wherein the base includes a first portion having a thermal conductivity of at least 30 watts/meter-Kelvin, and wherein the first portion of the base includes at least 30% of the interior of the base. Other aspects are described in the claims, drawings, and text forming a part of the present disclosure.