Electrical Device Characterization via Internal Voltage Clamping
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Solution Overview
Problem
Existing electrical device characterization methods face challenges in minimizing leakage currents and achieving accurate, fast characterization, particularly in sub-micron semiconductor processes, due to issues with voltage clamping and varying device dimensions.
Innovation Solution
The method involves arranging electrical devices in rows and columns with buffers on the same die or module to clamp voltages internally, minimizing leakage currents by dynamically controlling terminal connections and using internal buffers to isolate non-selected devices, allowing for accurate and rapid characterization of devices of different dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If all electrical devices are concentrated into an area for automated testing, then characterization speed is improved, but leakage current flows through non-selected devices degrading measurement accuracy
Solution Approach 1:
The patent divides the array of electrical devices into selected and non-selected groups, applying different voltage conditions to each segment. Selected devices receive normal operating voltages while non-selected devices have their gate terminals clamped to suppress leakage current, enabling parallel testing without cross-contamination of measurements.
Solution Approach 2:
The patent introduces voltage clamping circuitry as an intermediary mechanism between the test controller and the electrical devices. This clamping circuitry selectively applies suppressed voltage conditions to non-selected devices, acting as a mediator that isolates their leakage current from the measurement path while maintaining overall array-level testing.
2Object-affected harmful factors
If external voltage sources are used to clamp voltages at drain terminals and gate terminals, then leakage current in non-selected devices is reduced, but characterization time increases due to iterative voltage calibration
Solution Approach 1:
The patent implements preliminary voltage clamping configuration before actual measurement. The test controller pre-establishes the voltage clamping conditions for non-selected devices, ensuring that leakage current suppression is active before characterization begins, thereby eliminating the need for iterative calibration during measurement.
Solution Approach 2:
The patent enables the test structure to self-configuring voltage clamping conditions based on device selection status. The system automatically identifies selected vs. non-selected devices and applies appropriate voltage conditions without requiring external manual calibration, reducing characterization time while maintaining leakage current suppression.
3Device complexity
If a single external voltage is applied to clamp gate terminals or drain terminals of non-selected devices, then the clamping function is simplified, but leakage current cannot be fully suppressed for devices of different dimensions
Solution Approach 1:
The patent applies different voltage clamping conditions to different segments of the device array based on their selection status and dimensional characteristics. Non-selected devices receive suppressed voltage conditions tailored to their specific requirements, while selected devices maintain normal operating conditions, enabling effective leakage current suppression across diverse device geometries.
Solution Approach 2:
The patent implements dynamic voltage clamping that adapts to different device dimensions and selection states. The test controller dynamically adjusts clamping voltage levels based on real-time device identification, allowing the same clamping infrastructure to effectively manage devices of varying dimensions without requiring separate static clamping circuits for each device type.
Data Source
AI summary
A method of electrical device characterization comprises: providing an array of electrical devices arranged in rows and columns, wherein each electrical device has a first terminal, a second terminal and a third terminal; clamping a first voltage at a first terminal of a selected electrical device via a first buffer or an first external voltage source; clamping a second voltage at a second terminal of a selected electrical device via a second buffer or a second external voltage source; controlling a third buffer to couple the third terminal of the selected electrical device to a first terminal or a second terminal of at least one non-selected column of electrical devices; and deriving a characterization result via the third terminal of the selected electrical device; wherein the array of electrical devices, the first buffer, the second buffer and the third buffer are on a same die or a same module.