Device-Embedded Flexible Circuit Board Thickness Reduction
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Solution Overview
Problem
Existing flexible printed circuit boards (FPCBs) face challenges in reducing thickness while maintaining integration and electrical performance, which affects response time and power consumption.
Innovation Solution
A device-embedded FPCB design featuring a first conductive layer, a first insulating layer with bump holes and grooves, a first plating layer, and a semiconductor device with bumps inserted into the bump holes, along with a second insulating and conductive layer, via-holes, and a second plating layer, all optimized for reduced thickness and improved electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the thickness of the FPCB is reduced to improve flexibility and response time, then flexibility and response time are improved, but the integration capability and structural stability deteriorate
Solution Approach 1:
The patent embeds electronic devices (such as capacitors, resistors, or semiconductors) directly within the FPCB structure by forming cavities in the insulating layer and placing devices within these cavities. This nesting approach allows multiple functional elements to occupy the same spatial envelope, effectively reducing the overall thickness while maintaining integration capability. The embedded devices are surrounded by insulating material, creating a compact nested structure that preserves structural stability despite reduced thickness.
Solution Approach 2:
The patent transitions from a traditional planar arrangement of components to a three-dimensional embedded structure. By forming cavities within the insulating layer and placing devices within these cavities, the design utilizes the vertical dimension (thickness direction) to accommodate additional functionality. This dimensional transition allows the FPCB to maintain integration capability while reducing the horizontal footprint and overall thickness, thereby improving flexibility and response time.
2Ease of operation
If the thickness of the FPCB is reduced to improve flexibility, then flexibility is improved, but the number of parts that can be integrated deteriorates
Solution Approach 1:
The patent embeds electronic devices directly within the FPCB structure by forming cavities in the insulating layer and placing devices within these cavities. This nesting approach allows multiple functional elements to occupy the same spatial envelope, effectively reducing the overall thickness while maintaining integration capability. The embedded devices are surrounded by insulating material, creating a compact nested structure that preserves structural stability despite reduced thickness.
Solution Approach 2:
The patent combines the insulating layer and device housing into a single integrated structure. The insulating layer serves dual purposes: providing electrical insulation and forming the housing for embedded devices. This merging of functions allows the FPCB to integrate more parts within the same thickness constraint, thereby improving flexibility without sacrificing integration capability.
3Device complexity
If devices are embedded in the FPCB to improve integration, then integration is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent forms cavities for device embedding and conductive patterns for device connection during the FPCB manufacturing process itself, before the actual device assembly. The insulating layer is formed with pre-defined cavities, and conductive patterns are deposited in advance. This preliminary preparation allows devices to be simply inserted into the pre-formed cavities and connected to pre-formed conductive patterns, significantly reducing the complexity of the device assembly process while maintaining high integration capability.
Solution Approach 2:
The insulating layer serves multiple functions simultaneously: providing electrical insulation, forming housing for embedded devices, and containing pre-formed conductive patterns for device connection. This multi-functionality reduces the number of separate manufacturing steps and components needed, thereby reducing manufacturing complexity while achieving high integration. The same insulating layer structure supports both embedded devices and traditional surface-mounted components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the thickness of the FPCB, enhances integration, and improves electrical performance and flexibility, leading to faster response times and reduced power consumption.
Implementation Method 1
a first plating layer which is formed in the at least one groove of the first insulating layer
Implementation Method 2
a device which comprises at least one bump which is inserted into the at least one bump hole to be connected to the first conductive layer
Data Source
AI summary
A device-embedded flexible printed circuit board (FPCB) and a method of manufacturing the device-embedded FPCB are provided. The device-embedded FPCB includes: a first conductive layer; a first insulating layer which is disposed on the first conductive layer and includes at least one bump hole and at least one groove; a first plating layer which is formed in the at least one groove of the first insulating layer; and a device which includes at least one bump which is inserted into the at least one bump hole to be connected to the first conductive layer.