Device Embedded Substrate Lateral Metal Block Heat Dissipation
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Solution Overview
Problem
Conventional device embedded substrates face challenges in downsizing and noise reduction when embedding electronic devices with electrode terminals on both surfaces, as they require through-holes that increase area and wiring length, inhibiting efficient heat dissipation and conductive connections.
Innovation Solution
A device embedded substrate design featuring a metal block with electrical conductivity and heat-transfer properties, where the first connecting terminal on one surface and second connecting terminal on another surface are connected via conductive vias through insulation layers, allowing for efficient heat dissipation and conductive connection while minimizing substrate size and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through-hole is formed to conductively connect the electrode terminal on the bottom surface to the conductive layer on the front surface, then conductive connection is achieved, but the area occupied by the through-hole and increased wiring length inhibit downsizing and noise reduction
Solution Approach 1:
The patent transitions from a vertical through-hole connection (front surface to back surface) to a lateral connection path. The metal block is positioned adjacent to the electronic device in the lateral direction, and conductive vias connect the electrode terminal to the metal block through the insulation layer, eliminating the need for a through-hole that spans the entire substrate thickness.
Solution Approach 2:
The metal block serves as an intermediary element between the electrode terminal and the conductive layer. Instead of directly connecting the electrode terminal to the conductive layer through a through-hole, the metal block provides an alternative conductive path that reduces wiring length and minimizes area occupation.
2Temperature
If a heat-transfer member is embedded to extend to the conductive layer on the rear surface, then efficient heat dissipation is achieved, but the wiring length increases and downsizing is inhibited
Solution Approach 1:
The patent merges the heat-transfer function and conductive connection function into a single metal block structure. The metal block simultaneously serves as a heat-transfer member extending from the electronic device and as a conductive path to the conductive layer, eliminating the need for separate heat-transfer members and reducing overall wiring length.
3Adaptability or versatility
If electrode terminals are formed on both surfaces of the electronic device, then connectivity is improved, but a heat dissipation mechanism using a heat-transfer member cannot be introduced
Solution Approach 1:
The metal block is designed as a multi-functional component that simultaneously provides electrical connection for the electrode terminal on the bottom surface and serves as a heat-transfer member. This universal structure enables both connectivity and heat dissipation functions to coexist without compromising either.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective heat dissipation and conductive connection of electrode terminals on both surfaces, achieving downsizing and noise reduction by using a metal block with conductive vias, forming an efficient heat-dissipating path and reducing wiring length.
Implementation Method 1
a metal block which has electrical conductivity and a heat-transfer property
Implementation Method 2
a third conductive via that penetrates the third insulation layer
Data Source
AI summary
A device embedded substrate provided with first and second connecting terminals on different surfaces, the substrate including: an electrically conductive metal block having one surface connected to the first connecting terminal, and having a dimension in a lateral direction larger than that of the electronic device; an intermediate connecting portion juxtaposed to the electronic device, including first insulation layer and wiring layers, whereby the first wiring layer is connected to the one surface of the metal block via a first conductive via; a second insulation layer which accommodates the metal block; and a third insulation layer stacked on the second insulation layer to embed the electronic device and whereon a second wiring layer is stacked, wherein the second wiring layer is connected to the first wiring layer via a second conductive via and connected to the second connecting terminal of the electronic device via a third conductive via.