Device Mounting Substrate Using Electrolytic Plating and Resin
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Solution Overview
Problem
Existing methods for mounting devices on substrates, such as electroless plating, face challenges in achieving robust mechanical and electrical connections between device electrodes and wiring lines, particularly for miniature devices, due to the generation of micro-gaps and intermittent deposition interfaces, which affect mechanical strength and product yield, and struggle to meet lightfastness requirements for high-density LED displays.
Innovation Solution
A method utilizing electrolytic plating with a thermosetting resin layer and photo-curable areas to establish robust bonding between the device electrodes and metal wiring layers, allowing for precise alignment and self-alignment, and reducing the gap between the electrode pads and wiring lines, thereby enhancing mechanical and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electroless plating is used to connect device electrodes and wiring lines, then the connection is formed, but micro-gaps are generated and mechanical strength is reduced
Solution Approach 1:
A photosensitive resin layer is introduced as an intermediary substance between the device electrode and wiring line. This resin layer fills the gap completely before plating occurs, providing a continuous medium that prevents micro-gap formation and ensures robust mechanical bonding while maintaining electrical connectivity through the plating process.
Solution Approach 2:
The gap between the electrode pad and wiring line is deliberately controlled and reduced to a specific range (3-10 μm) through precise positioning. This parameter optimization ensures that the gap is small enough to be completely filled by the photosensitive resin layer, preventing micro-gap formation while allowing sufficient space for resin infiltration and subsequent plating growth.
2Reliability
If the gap between electrode pad and wiring line is reduced for better connection, then electrical connectivity improves, but alignment precision becomes more difficult to achieve
Solution Approach 1:
The photosensitive resin layer performs multiple functions simultaneously: it fills the gap between electrode and wiring line, provides mechanical support during plating, and enables self-alignment through its photosensitive properties. The resin's ability to be selectively cured by light allows automatic alignment without requiring extremely precise manual positioning, thus achieving both small gap and high alignment precision.
Solution Approach 2:
The photosensitive resin layer is applied and cured before the plating process occurs. This preliminary action establishes the exact positioning and gap filling in advance, creating a stable foundation that guides subsequent plating growth and ensures both electrical connectivity and alignment precision are achieved before the final connection is formed.
3Reliability
If plating layer thickness is increased to fill micro-gaps, then electrical connection is achieved, but deposition time and cost increase
Solution Approach 1:
The photosensitive resin layer acts as a pre-filled intermediary that eliminates micro-gaps before plating begins. By completely filling the gap with resin, the plating process only needs to deposit metal on the resin surface and at the electrode-wiring interface, rather than attempting to fill irregular micro-gaps during deposition. This dramatically reduces the required plating thickness and deposition time while ensuring complete electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides robust, reliable connections that improve mechanical strength, reduce thermal resistance, and enhance lightfastness, enabling the miniaturization of devices and reducing costs, while maintaining high light-emitting performance in LED displays.
Implementation Method 1
terminal connection of the devices is performed by using a wiring line of the substrate as a seed metal using electrolytic plating
Implementation Method 2
A method utilizing electrolytic plating with a thermosetting resin layer and photo-curable areas
Data Source
AI summary
An assembly including a substrate, a metal wiring layer on the substrate, the metal wiring layer having an opening therein, a thermosetting resin layer on at least a portion of the substrate overlapping the opening of the metal wiring layer, and a device on the resin layer, the device positioned over the opening of the metal wiring layer and bonded to the substrate via the resin layer.