Electronic Device Packaging Structure With Self-Adjusting Clamp Posture
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Solution Overview
Problem
Existing packaging structures face challenges in improving workability and ensuring reliable packaging for electronic devices during transport.
Innovation Solution
A packaging structure comprising a pair of packaging materials with contact surfaces and a coupling portion, where the materials change posture from a first to a second position upon pressing against the coupling portion, allowing them to sandwich the device, and a packaging method that utilizes a round portion to facilitate this change.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional packaging structures are used, then packaging reliability can be ensured, but workability and packaging efficiency are poor
Solution Approach 1:
The packaging structure employs dynamic packaging materials that automatically change posture from a first state (not contacting the packaging target) to a second state (contacting and sandwiching the packaging target) when the packaging target is pressed against the coupling portion. This dynamic adaptation eliminates the need for manual adjustment, simultaneously improving packaging efficiency and workability.
2Productivity
If manual packaging adjustment is required, then packaging reliability can be ensured, but packaging efficiency decreases
Solution Approach 1:
The packaging structure is designed to perform self-adjustment automatically. When the packaging target is placed on the packaging body and pressed against the coupling portion, the packaging materials autonomously transition to the correct positioning state without requiring operator intervention, thereby reducing packaging time and increasing efficiency.
3Reliability
If packaging materials are positioned to contact the packaging target, then packaging reliability is improved, but ease of operation deteriorates due to complex positioning
Solution Approach 1:
The packaging materials are pre-configured with round portions that contact the upper surface of the workbench, positioning the packaging materials in advance. When the packaging target is pressed against the coupling portion, this preliminary configuration enables automatic transition to the correct contact posture, ensuring reliability while simplifying operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves workability and ensures reliable packaging by enabling easy and automated packaging of electronic devices, providing effective protection during transport.
Implementation Method 1
a round portion provided outside of each of the pair of packaging materials, and in contact with an upper surface of a workbench in a state of being placed on the upper surface, the round portions being positioned under the coupling portion
Data Source
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AI summary
Workability is to be improved, and reliable packaging is to be ensured. A packaging structure includes a pair of packaging materials (2, 3) each having contact surfaces (2A, 2B, 2C, 2D) capable of coming into contact with a plurality of surfaces of an electronic device, which is a packaging target, a coupling portion (4) coupling the pair of packaging materials (2, 3), and a round portion (2E) provided outside the pair of packaging materials (2, 3), and in contact with an upper surface (G) in a state of being placed on the upper surface (G) of a workbench, the round portions being positioned under the coupling portion (4) and apart from each other on both sides of the coupling portion (4), in which when the electronic device is pressed against the coupling portion (4) and placed on the upper surface (G), the pair of packaging materials (2, 3) changes a posture from a first posture in which the contact surfaces (2A, 2B, 2C, 2D) are not in contact with the plurality of surfaces of the electronic device to a second posture in which the contact surfaces (2A, 2B, 2C, 2D) come into contact with the plurality of surfaces to sandwich the electronic device.