Device-Specific Thermal Mitigation Using Fuse Tables

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Solution Overview

Problem

Integrated circuits (ICs) face performance degradation and potential failure due to uncontrolled thermal behavior, with existing universal mitigation strategies penalizing above-average devices by setting performance limits based on the worst-case scenario, leading to suboptimal performance and risk.

Innovation Solution

Device-specific thermal mitigation is achieved by characterizing thermal and power behavior, determining a unique thermal threshold for each device, and storing this information in a cross-reference matrix, with correlation factors used to set a device-specific mitigation temperature, which can be permanently stored in a fuse table or EEPROM, allowing for software-controlled operation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If universal thermal mitigation strategies are used based on worst-case scenario, then reliability is improved, but productivity deteriorates due to performance penalties for above-average devices

Engineering Contradiction:
Improvethermal reliabilityVSAvoiddevice performance
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent segments the device population into individual devices with unique thermal characteristics. Each device is tested and assigned its own thermal threshold and mitigation temperature rather than using a universal threshold. This segmentation allows above-average devices to operate at higher performance levels while only applying conservative limits to devices that actually need them, thus maintaining reliability without unnecessarily penalizing productivity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by customizing thermal mitigation parameters for each individual device based on its specific thermal behavior. Each device receives a tailored mitigation temperature stored in its fuse table or EEPROM, rather than applying a uniform threshold across all devices. This ensures that each device operates with the precise thermal limits it requires, optimizing performance for each unit while maintaining overall system reliability.

Inventive Principle:
Principle #3Local quality

2Productivity

If individual device characterization is performed, then productivity is improved by avoiding performance penalties, but device complexity increases due to additional testing and data storage requirements

Engineering Contradiction:
Improvedevice performanceVSAvoidtesting and storage complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent performs preliminary thermal characterization testing during the manufacturing process for each individual device. The thermal threshold and mitigation temperature are determined and stored in the device's fuse table or EEPROM before the device is shipped. This preliminary action ensures that when the device is deployed, it can immediately operate with its optimized thermal parameters without requiring complex runtime characterization, thus improving productivity while managing complexity through upfront testing.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements self-service by having each device store its own thermal characterization data in its internal fuse table or EEPROM memory. The device uses this stored information to autonomously determine its own mitigation temperature and operate within its optimal thermal range without requiring external lookup tables or complex runtime analysis. This self-service approach simplifies the overall system complexity while enabling individualized performance optimization.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS10215800B2Device specific thermal mitigation
Publication Date: 2019.02.26 QUALCOMM INC
  • US10215800B2 patent drawing
  • US10215800B2 patent drawing
  • US10215800B2 patent drawing

AI summary

Embodiments contained in the disclosure provide a method and apparatus for device specific thermal mitigation. The thermal and power behavior of the device, is characterized. A thermal threshold is then determined for the device. The thermal data and thermal ramp factor for each device are determined and stored in a cross-reference matrix. A correlation factor is determined for temperature and frequency. These correlation factors determine a device mitigation temperature. The device mitigation temperature may be stored in a fuse table on the device, with a fuse blown on the device to permanently store the device mitigation temperature. The apparatus includes: an electronic device, a memory within the electronic device, and a set of fuses within the electronic device. The device also includes means for determining if a static or dynamic frequency is high, and means for mitigating a voltage and frequency used by the device, based on that determination.