Device Substrate Side Wiring for Narrower Display Side Frames
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Solution Overview
Problem
Existing display panel designs face challenges in reducing the side frame area due to the thickness of flexible circuit boards, which hinder full attachment to the display panel's side surface, limiting further reduction of side frames.
Innovation Solution
A device substrate manufacturing method involving glancing angle deposition processes forms a side wiring structure with specific thickness ratios and streaks to enhance adhesion and protection, reducing side frame dimensions and improving production yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible circuit board is used to connect pads on the front side to the back side, then electrical connection is achieved, but the thickness of the flexible circuit board prevents full attachment to the side surface, limiting further reduction of side frame area
Solution Approach 1:
The patent transitions from a planar flexible circuit board to a three-dimensional side wiring structure that extends vertically along the side surface of the display panel. This dimensional change allows the wiring to follow the profile of the side surface, enabling full attachment and reducing the horizontal area occupied by side frames while maintaining electrical connectivity between front and back sides.
Solution Approach 2:
The patent employs thin film deposition techniques to create the side wiring structure, using conformal coating methods to deposit conductive materials as thin films that adhere to the side surface profile. This approach replaces the thick flexible circuit board with a thin film-based wiring solution that can fully conform to the side surface geometry.
2Ease of manufacture
If conventional deposition methods are used to form the side wiring structure, then manufacturing simplicity is maintained, but adhesion and protection against breakage or peeling are insufficient
Solution Approach 1:
The patent modifies deposition parameters including applying multiple layers with different thicknesses (first portion, second portion, third portion with thickness ratios of 0.25-0.6), controlling deposition angles, and adjusting material composition. These parameter changes enhance adhesion properties and structural integrity while maintaining manufacturability through standardized deposition processes.
Solution Approach 2:
The patent uses composite material structures with multiple conductive layers and insulating layers deposited in sequence. The side wiring structure comprises stacked layers including conductive materials and insulating materials, creating a composite structure that provides both electrical functionality and mechanical protection against breakage and peeling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces side frame dimensions and enhances the production yield of the side wiring structure by ensuring better adhesion and protection against breakage or peeling.
Implementation Method 1
A first glancing angle deposition process is performed above a front side and a side surface of the circuit substrate by applying a first target, where a first included angle exists between a front side of the first target and the side surface of the circuit substrate
Data Source
AI summary
A device substrate includes a circuit substrate and a side wiring structure. The circuit substrate includes a substrate and a front circuit structure on a front side of the substrate. The side wiring structure is electrically connected to the front circuit structure and extends from the front circuit structure to a back side of the circuit substrate. A cross-sectional structure of the side wiring structure includes a first portion, a second portion, and a third portion respectively located above a front side, a side surface, and the back side of the circuit substrate. The first, second, and third portions each include streaks. A ratio of a maximum thickness of the first portion to a maximum thickness of the second portion is A. A ratio of a maximum thickness of the third portion to the maximum thickness of the second portion is B. Each of A and B is 0.25-0.6.