Di-Amine Resin Composition for Low-Temperature Curing Films
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Solution Overview
Problem
Polybenzoxazole precursors with lower curing temperatures exhibit poor chemical resistance, and photosensitive resin compositions containing novolac resins have issues with low elongation, making them unsuitable for applications requiring high chemical resistance and mechanical properties at low thermal treatment temperatures.
Innovation Solution
A di-amine compound represented by a specific general formula is used to create a heat-resistant resin composition that can be cured at temperatures of 200°C or less, providing excellent chemical resistance and film properties, and is incorporated into a resin composition with a photosensitive compound and solvent for use in semiconductor and organic electroluminescent applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a polybenzoxazole precursor with lower curing temperature is used, then the curing temperature is reduced to about 200°C or less, but the chemical resistance deteriorates
Solution Approach 1:
The invention changes the chemical structure parameters of the di-amine compound by introducing specific aliphatic groups (R1-R6) with controlled chain lengths and configurations. This structural modification enables the polymer to achieve both low curing temperature (200°C or less) and high chemical resistance by optimizing the balance between molecular flexibility and crosslinking density
Solution Approach 2:
The invention creates a composite chemical structure within the di-amine compound by combining aromatic rings (providing rigidity and chemical resistance) with aliphatic chains (providing flexibility and enabling low-temperature curing). The specific combination of these different chemical group types achieves both contradictory properties simultaneously
2Temperature
If a photosensitive resin composition containing novolac resin with crosslinking group is used, then the curing temperature is reduced, but the degree of elongation deteriorates
Solution Approach 1:
The invention modifies the molecular parameters of the di-amine compound by incorporating aliphatic groups with specific chain lengths (C1-C20) and structures (linear, branched, cyclic). These parameter changes provide molecular flexibility that maintains high degree of elongation even after low-temperature curing, unlike rigid novolac resins
3Reliability
If conventional polyimide or polybenzoxazole is used, then excellent heat resistance and mechanical properties are obtained, but a burning at high temperature of about 350°C is necessary
Solution Approach 1:
The invention changes the chemical structure parameters by replacing part of the rigid aromatic structure with flexible aliphatic groups in the di-amine compound. This structural parameter change lowers the curing temperature to 200°C or less while maintaining heat resistance through the remaining aromatic components and crosslinking structure
Solution Approach 2:
The invention creates a composite molecular structure combining aromatic rings (for heat resistance) and aliphatic chains (for low-temperature processing). This composite approach at the molecular level achieves both low curing temperature and excellent heat resistance, solving the contradiction between processing temperature and final performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The di-amine compound enables the production of a resin composition with high chemical resistance and elongation, suitable for low-temperature thermal treatments, enhancing the performance of semiconductor and organic electroluminescent devices by providing a flexible and durable cured film.
Implementation Method 1
a thin film having excellent heat resistance and mechanical properties is obtained by thermally dehydrating and ring-closing a coated film of a precursor of the polyimide or the polybenzoxazole
Implementation Method 2
a heat-resistant material imparted with photosensitivity has been studied for the purpose of rationalizing the working process
Data Source
AI summary
The present invention relates to a novel di-amine compound, a heat-resistant resin using the di-amine compound, and a resin composition using the heat-resistant resin, and a cured film excellent in chemical resistance and film properties even by a thermal treatment at a low temperature of 200° C. or less can be obtained. The novel di-amine compound is represented by the general formula (1). The heat-resistant resin composition of the present invention or the resin composition can be suitably used in a surface protective film and an interlayer dielectric film of a semiconductor device, a dielectric layer or a planarizing layer of an organic electroluminescent element (organic EL), or the like.(In the general formula (1), R1 and R2 each are a divalent aliphatic group, R3 and R4 each are a divalent aliphatic group, aliphatic ring group, aromatic group, a divalent organic group bonded to an aromatic group by —O—, —CO—, —SO2—, —CH2—, —C(CH3)2— or —C(CF3)2— (wherein F is fluorine), a divalent organic group in which two or more aromatic groups are bonded by a single bond, or a divalent organic group in which two or more aromatic groups are bonded by —O—, —CO—, —SO2—, —CH2—, —C(CH3)2— or —C(CF3)2— (wherein F is fluorine), R5 and R6 each are an organic group having any of a hydrogen atom, a halogen atom, a hydroxyl group, a nitro group, a cyano group, an aliphatic group, an aromatic group, an acetyl group, a carboxyl group, an ester group, an amide group, an imide group, and a urea group, A is a divalent aliphatic group, aliphatic ring group, aromatic group, a divalent organic group in which two or more aromatic groups are bonded by a single bond, or a divalent organic group in which two or more aromatic groups are bonded by —O—, —S—, —CO—, —SO2—, —CH2—, —C(CH3)2— or —C(CF3)2— (wherein F is fluorine), p and q each are an integer number in the range of 0 to 3).