Diagnostic Chip Assembly With Same-Side Contacts for Low-Cost Flowcells
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Solution Overview
Problem
Conventional MEMS technologies face challenges in providing a flexible and cost-effective sample preparation front end for semiconductor detection chips, requiring complex and costly fluidic assemblies and manual operations, which limits the integration and efficiency of 'lab on a chip' devices in diagnostic testing.
Innovation Solution
The development of diagnostic detection chips with a streamlined design that integrates electrical interfaces on the same side as the active surface, allowing for flexible substrates, probe contacts, and eliminating the need for a separate PCB, enabling seamless integration with existing sample processing technologies and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional chip packaging with separate PCB is used, then electrical connections are established, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the electrical interface contacts directly onto the active surface of the semiconductor chip, merging the chip and PCB functions into a single integrated component. This eliminates the need for separate wire bonding and PCB assembly, thereby reducing device complexity and manufacturing cost while maintaining electrical connectivity.
2Adaptability or versatility
If conventional fluidic assemblies are used for sample preparation, then sample processing is achieved, but system complexity and cost increase
Solution Approach 1:
The patent segments the sample preparation process into distinct functional regions or chambers integrated directly with the chip device. This allows for modular implementation of different processing steps (chemical, optical, electrical, mechanical, thermal, or acoustical) while maintaining overall system simplicity and reducing the need for complex external fluidic assemblies.
3Ease of manufacture
If chip is incorporated into conventional package, then electrical connections are established, but integration with flowcell components is reduced
Solution Approach 1:
The patent extracts the electrical interface from the conventional chip package structure and places it directly on the active surface of the chip. This eliminates the intermediate packaging layer and enables direct integration with flowcell components, improving ease of manufacture and integration while reducing overall device complexity.
Data Source
AI summary
Diagnostic detection chip device designs that reduce cost of fabrication and assembly are described herein. Such chip device designs include features that facilitate use of the chip within a chip carrier device with integrated fluid flow control features and compatibility with conventional sample cartridges and sample processing systems. Associated methods of manufacture and assembly of the chip devices are also provided herein.