Diagnostic Device for Mirror Surface Machining Streaks
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Solution Overview
Problem
Existing diagnostic methods for mirror surface machining do not effectively identify the frequencies of peripheral devices causing streaks on machined surfaces, limiting the ability to take anti-vibration measures and achieve precise machining.
Innovation Solution
A diagnostic device and method that acquire spindle rotational frequency, pitch of streaks, and feed rate to calculate streak frequency, and then determine causal frequencies causing vibrations, notifying operators of potential peripheral device vibrations to enable targeted anti-vibration measures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional diagnostic methods are used to detect chatter vibrations during machining, then the natural frequency of the spindle can be estimated and chatter vibrations can be suppressed, but the frequencies of peripheral devices causing streaks cannot be identified
Solution Approach 1:
The diagnostic method is segmented into distinct analysis stages: first analyzing chatter vibration frequencies during machining to determine spindle natural frequency, then separately analyzing peripheral device vibration frequencies. This segmentation allows each frequency source to be independently identified and addressed, resolving the information loss about peripheral device frequencies.
Solution Approach 2:
The invention introduces an intermediary diagnostic process that bridges the gap between machining parameters and peripheral device vibrations. By using the relationship between feed rate, pitch, and calculated frequency as an intermediary, the system can trace back from observed machining defects to the specific peripheral devices causing them.
2Stability of the object's composition
If the spindle rotational frequency is adjusted based on estimated natural frequency to suppress chatter vibrations, then machining stability improves, but streaks caused by peripheral device vibrations persist
Solution Approach 1:
The invention applies dynamic adjustment of spindle rotational frequency based on real-time diagnostic information. Rather than using a fixed rotational speed, the system dynamically determines the optimal frequency by analyzing both chatter vibrations and peripheral device vibrations, allowing the machining parameters to adapt to the actual vibration environment and eliminate both chatter and streaks.
Solution Approach 2:
The system changes the operational parameters (spindle rotational frequency and feed rate) based on diagnosed vibration frequencies. By calculating the causal frequency from observed streak pitch and feed rate, the system can adjust parameters to avoid resonant frequencies caused by peripheral devices, thereby improving surface quality while maintaining stability.
3Manufacturing precision
If mirror surface machining is performed with high precision, then the machined surface quality improves, but streaks occur due to vibrations from peripheral devices
Solution Approach 1:
The diagnostic device performs preliminary identification of peripheral device vibration frequencies before mirror surface machining. By calculating the causal frequency from the relationship between feed rate and streak pitch, the system can predict and prevent streak formation by adjusting machining parameters in advance, countering the harmful effect of peripheral device vibrations before they manifest as defects.
Solution Approach 2:
The invention implements a feedback mechanism where the observed streak pitch and machining parameters are used to calculate the causal vibration frequency, which then feeds back into adjusting the spindle rotational frequency and feed rate. This closed-loop control continuously eliminates streaks by adapting to the actual vibration environment created by peripheral devices.
Data Source
AI summary
A diagnostic device includes: a spindle rotational frequency acquisition unit configured to acquire a spindle rotational frequency of a spindle; a pitch acquisition unit configured to acquire a pitch of streaks generated on a surface of a workpiece; a feed rate acquisition unit configured to acquire a feed rate of a tool when mirror surface machining is performed on the surface of the workpiece; a streak frequency calculator configured to calculate a streak frequency that is a cause of the streaks, from the pitch of the streaks and the feed rate of the tool; a causal frequency calculator configured to calculate a causal frequency which causes vibrations of the streak frequency; and a notifying unit configured to indicate whether or not there is a peripheral device that generates vibrations at the causal frequency, around a machine tool.