Diagonal PCB Layout for Li-Ion BMS Heat and Current Sharing

The patent applies asymmetry by arranging MOSFETs and current sense resistors in a diagonal pattern rather than a linear arrangement. This asymmetric diagonal layout optimizes the thermal paths and current distribution across the PCB, allowing each component to have adequate heatsinking capability while maintaining equal current sharing. The diagonal orientation creates asymmetric thermal zones that improve heat dissipation efficiency compared to traditional linear arrangements.

The patent merges the heatsinking function directly into the PCB structure by creating integrated thermal zones that combine multiple functions. The diagonal arrangement allows shared thermal paths where adjacent MOSFETs and current sense resistors utilize common heatsinking areas on the PCB. This merging of thermal management functions into the existing PCB structure eliminates the need for additional discrete MOSFETs or external heatsinks, thereby reducing component count and saving battery internal space while maintaining effective thermal management.

The patent applies local quality by creating distinct thermal zones around each MOSFET and current sense resistor in the diagonal arrangement. Each component has its own optimized thermal path and heatsinking area tailored to its specific power dissipation requirements. This localized thermal management ensures that each component operates within its thermal limits, promoting equal current sharing and preventing any single component from being overloaded, thereby improving reliability while maintaining high current carrying capacity.