Semiconductor Chip Layout for Diagonal Inter-Chip Data Transfer
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Solution Overview
Problem
Existing semiconductor devices face challenges in providing efficient inter-chip communications, particularly when chips are placed on diagonal lines, making it difficult to wire signals between them.
Innovation Solution
A semiconductor device configuration with four chips mounted on a substrate, where the first and third chips are placed on one diagonal line, and the second and fourth chips on another, with transferring circuits in the second and fourth chips facilitating data transfer between the first and third chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If chips are placed on diagonal lines of the substrate, then the substrate area utilization is improved, but it becomes difficult to provide wires between the chips for electrical coupling
Solution Approach 1:
The patent introduces an intermediary chip (the second chip) positioned between the first and third chips on the diagonal. This intermediary chip contains transferring circuits that relay data between the diagonally placed chips, effectively mediating the connection that would otherwise be difficult to establish directly due to the diagonal placement configuration.
Solution Approach 2:
The patent changes the data transfer path from a direct diagonal connection (2D shortest path) to a multi-hop path through adjacent chips. By utilizing the intermediate chip position, the data transfer effectively moves through an additional dimensional step (first chip → intermediate chip → third chip), transforming the direct diagonal wire routing problem into a sequence of adjacent chip connections.
2Speed
If wires are provided between diagonally placed chips, then direct data transfer is achieved, but signal skew increases and manufacturing becomes difficult
Solution Approach 1:
The intermediary chip acts as a signal synchronization point. By routing data through the intermediate chip's transferring circuits, the system achieves signal synchronization at each hop, preventing the accumulation of signal skew that would occur in long direct diagonal connections. The intermediary chip ensures reliable data transfer by managing timing and synchronization.
3Reliability
If transferring circuits are added to enable diagonal chip communication, then inter-chip communication reliability is improved, but device complexity increases
Solution Approach 1:
The transferring circuits in the intermediary chip serve multiple functions: they act as data relays between diagonally placed chips, provides signal synchronization, and enable flexible routing configurations. This multi-functionality justifies the added complexity by delivering comprehensive communication capabilities that simplify the overall system design compared to implementing direct diagonal connections.
Data Source
AI summary
A semiconductor device includes a first chip, a second chip, a third chip, and a fourth chip. The first chip is placed adjacent to the second chip and the fourth chip. The third chip is placed adjacent to the second chip and the fourth chip at a position different from a position of the first chip. Data of the first chip is transferred from the first chip to the third chip via the second chip. Data of the third chip is transferred from the third chip to the first chip via the fourth chip. The data transferred from the first chip to the second chip is transferred via a wiring layer formed over a silicon and placed at a position different from positions of the first chip, the second chip, the third chip, and the fourth chip.