Diagonal IC Signal Routing Through Support Device Conductors

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing electronic circuit systems with integrated circuits (ICs) face high latency and significant power consumption when IC dies are oriented diagonally, limiting performance and efficiency.

Innovation Solution

The circuit system employs a support device with conductors that provide electrical pathways for signal transmission between ICs, allowing for reduced latency and higher bandwidth through horizontal, vertical, or stepped configurations, bypassing core region routing to minimize power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If signal transmission routes through core region of ICs, then routing flexibility is improved, but power consumption increases and latency increases

Engineering Contradiction:

Improverouting flexibilityVSAvoidpower consumption

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The patent segments the signal transmission path by routing signals through the support device substrate rather than through the core region of intermediate ICs. This separates the routing function (handled by conductors in the support device) from the processing function (handled by IC core regions), thereby reducing power consumption and latency while maintaining routing flexibility through the substrate conductor network.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support device substrate acts as an intermediary, providing dedicated conductors that facilitate direct signal transmission between ICs. This intermediary routing path bypasses the need for signals to traverse through intermediate IC core regions, reducing both power consumption and latency while maintaining system adaptability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If signal transmission routes through core region of ICs, then routing flexibility is improved, but latency increases

Engineering Contradiction:

Improverouting flexibilityVSAvoidlatency

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent segments the signal transmission path by routing signals through the support device substrate rather than through the core region of intermediate ICs. This separates the routing function (handled by conductors in the support device) from the processing function (handled by IC core regions), thereby reducing latency while maintaining routing flexibility through the substrate conductor network.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If additional steering and buffering logic is added, then signal transmission between diagonally oriented ICs is improved, but device complexity and cost increase

Engineering Contradiction:

Improvesignal transmissionVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent uses the support device substrate as an intermediary structure that provides dedicated conductors for signal transmission. This approach eliminates the need for complex steering and buffering logic within individual ICs, as the substrate itself provides the routing infrastructure, thereby reducing device complexity and cost while improving signal transmission reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent implements a standardized routing infrastructure on the support device substrate that can be replicated for different IC configurations. This copying of the routing pattern across the substrate provides reliable signal transmission without requiring custom steering logic for each IC pair, reducing overall system complexity.

Inventive Principle:

Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves performance by reducing latency and power consumption while maintaining cost-effectiveness, enabling efficient signal transmission between diagonally oriented ICs without the need for additional steering and buffering logic.

Implementation Method 1

The conductors in the support device and in the second integrated circuit provide electrical pathways for signals to be transmitted between the first and third integrated circuits in the circuit system

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20230342309A1Circuit Systems And Methods For Transmitting Signals Between Devices

Publication Date: 2023.10.26 ALTERA CORP

AI summary

A circuit system includes a support device that has first and second conductors. The circuit system also includes first, second, and third integrated circuits that are coupled to the support device. The second integrated circuit includes a peripheral region. The peripheral region includes a third conductor coupled between the first and the second conductors. The circuit system is configured to transmit a signal from the first integrated circuit through the first conductor, the third conductor, and the second conductor to the third integrated circuit. The first and the third integrated circuits are positioned diagonally in the circuit system