Diagonal Motherboard Assembly for Thin Laptop Design
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Solution Overview
Problem
Conventional premium laptops face limitations in thickness reduction due to the overlap of the motherboard and keyboard, and the need for space in the clamshell profile for heat dissipation, which affects their compactness and performance.
Innovation Solution
The implementation of an inclined motherboard assembly with attachment members and a thermal transfer unit, allowing for a standard keyboard configuration while optimizing space usage and heat management, enabling a thinner laptop design without compromising performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the motherboard is positioned horizontally overlapping with the keyboard, then the keyboard can maintain standard size with all keys, but the laptop thickness increases to 9-12 mm
Solution Approach 1:
The motherboard is rotated from a horizontal position to a diagonal orientation at approximately 45 degrees, utilizing the z-direction (thickness dimension) more effectively. This dimensional repositioning allows the motherboard to overlap less with the keyboard while still fitting within the clamshell profile, reducing overall thickness to 6-8 mm without sacrificing standard keyboard functionality.
Solution Approach 2:
The motherboard is positioned asymmetrically at a diagonal angle rather than symmetrically horizontally, creating an optimized spatial arrangement that reduces overlap with the keyboard area while maintaining all necessary component connections and functionality within the constrained thickness envelope.
2Object-affected harmful factors
If a mechanical fan is removed for fanless operation, then noise is reduced and space is saved, but heat dissipation space must be optimized within the thin profile
Solution Approach 1:
The mechanical fan is completely removed from the system, extracting the noise-generating component while relying on alternative passive or active heat dissipation methods integrated into the motherboard and clamshell structure to manage thermal loads in the fanless design.
Solution Approach 2:
The clamshell structure and motherboard design incorporate multi-functional elements that serve both structural support and heat dissipation functions, with thermal pathways integrated into existing structural components rather than requiring separate dedicated cooling infrastructure.
3Length of stationary object
If the clamshell thickness is reduced to 6-8 mm, then the laptop becomes more compact and premium, but the motherboard and keyboard overlap is reduced which complicates layout design
Solution Approach 1:
By rotating the motherboard to a diagonal orientation, the design utilizes the z-direction and lateral space more efficiently, allowing all necessary components and connections to fit within the reduced 6-8 mm thickness without excessive overlap, thereby reducing complexity compared to a horizontal arrangement that would require more z-space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves a laptop thickness of less than 10 mm, maintains standard keyboard functionality, and enhances CPU performance through effective thermal management, addressing the constraints of conventional designs.
Implementation Method 1
a thermal transfer unit coupled to one or more component on the motherboard
Data Source
AI summary
According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.