Diagonal PCB Heat Sinking for Li-Ion Battery BMS
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Solution Overview
Problem
Existing lithium-ion battery management systems (BMS) face challenges in managing temperature rise due to limited space and cost constraints, particularly with MOSFETs and current sense resistors, which require effective heat sinking without increasing component count or size.
Innovation Solution
A diagonal arrangement of electronic components and heat sinking structures on the PCB, utilizing diagonally oriented conductive metal plates and pads for improved heat dissipation and equal current sharing, with components connected in series or parallel configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If surface mount MOSFETs are soldered to PCB using copper traces and pads, then cost is reduced, but heat sinking effectiveness is limited
Solution Approach 1:
The patent merges the electrical connection function and thermal management function into a single integrated structure. Thick copper traces serve dual purposes: electrical conduction for MOSFET operation and heat sinking for thermal management. This eliminates the need for separate heat sinking components while maintaining cost-effectiveness.
Solution Approach 2:
The patent transitions from two-dimensional copper pads to three-dimensional copper structures by adding vertical thickness through multiple copper layers and via connections. This dimensional enhancement significantly increases the heat sinking capacity while maintaining the surface mount approach.
2Temperature
If external heatsink is attached using mechanical fasteners and thermal grease, then heat sinking capability is improved, but thermal resistance of connections increases
Solution Approach 1:
The patent combines the electrical connection path and thermal conduction path into a single continuous copper structure. The same thick copper traces that carry electrical current also serve as thermal conduction pathways, eliminating the need for separate thermal interfaces and reducing thermal resistance.
Solution Approach 2:
The thick copper traces act as an intermediary that simultaneously handles electrical and thermal transmission. This mediator provides a low-resistance pathway for both electricity and heat, replacing the need for separate mechanical fasteners and thermal grease interfaces.
3Reliability
If multiple MOSFETs are added to handle large battery current, then current sharing is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent merges multiple MOSFETs into a single integrated power MOSFET module that handles the full battery current. The module internally contains multiple parallel MOSFETs with automatic current sharing, eliminating the need for separate external MOSFETs while reducing overall complexity.
Solution Approach 2:
The integrated power MOSFET module serves multiple functions simultaneously: it handles high current switching, provides inherent current sharing through internal parallel structures, and offers substantial heat sinking capability through its integrated thermal path to the PCB.
4Ease of manufacture
If BMS components are arranged linearly on PCB, then ease of assembly is improved, but space utilization and heat sinking efficiency are reduced
Solution Approach 1:
The patent utilizes the vertical dimension by implementing multi-layer PCB structures with thick copper traces on multiple layers. This allows linear arrangement of components while achieving three-dimensional heat sinking capacity, effectively adding thermal management volume without increasing planar footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The diagonal arrangement allows for compact BMS design that effectively manages heat and current distribution, preventing component failure while optimizing space and cost efficiency.
Implementation Method 1
The diagonal arrangement provides orienting electronic components, for example, PCB components (e.g. conductive plates, fills, and/or traces), MOSFETs, and/or current sense resistors in a diagonal structure or arrangement to provide a compact structure and arrangement and/or a diagonal heating sinking structure and arrangement to maximize heat sinking capability of the PCB of the BMS
Data Source
AI summary
A battery management system (BMS) having a printed circuit board (PCB) with a diagonal arrangement for use in a Li-ion battery, a Li-ion battery having a battery management system (BMS) having a printed circuit board (PCB) with a diagonal arrangement, and a BMS having a printed circuit board with diagonal arrangement method.