Diagonal Via Opening Patterns for Semiconductor Reticle Resolution
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Solution Overview
Problem
The miniaturization of semiconductor devices leads to increased wiring density, making it difficult to form vias effectively due to the proximity of via opening patterns, resulting in via deformation and shorts, which lowers the yield and reliability of semiconductor devices.
Innovation Solution
A reticle with via opening patterns arranged diagonally to increase the minimum distance between neighboring via opening patterns, allowing for improved resolution and preventing via deformation and shorts, while maintaining the degree of integration of vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the degree of integration is increased by miniaturization of elements, then wiring density is improved, but via formation becomes difficult due to insufficient resolution
Solution Approach 1:
The patent rotates the via opening patterns by 45 degrees relative to the wiring directions, changing the spatial orientation dimension. This rotation transforms the minimum distance calculation from axial alignment to diagonal spacing, effectively increasing the resolvable pitch without changing the physical via size or density
Solution Approach 2:
The patent changes the angular parameter of via opening pattern orientation from 0 degrees (parallel to wirings) to 45 degrees (diagonal to wirings). This parameter change exploits the optical resolution characteristics to achieve better via formation while maintaining the same via density and wiring layout
2Productivity
If via opening patterns are arranged closely to increase via density, then productivity is improved, but optical resolution deteriorates causing via deformation and shorts
Solution Approach 1:
The patent introduces a rotational dimension to the via opening pattern arrangement, positioning them at 45 degrees to the wiring directions. This dimensional change maximizes the minimum distance between adjacent vias in the optical field, improving resolution while maintaining high via density in the physical layout
3Manufacturing precision
If via opening patterns are rotated diagonally to increase minimum distance, then via formation resolution is improved, but device area increases
Solution Approach 1:
The patent changes only the angular parameter of via opening pattern orientation without altering the physical via dimensions, wiring pitch, or overall device footprint. The diagonal arrangement optimizes the use of existing space by exploiting the optical resolution limit, achieving better via formation without expanding the device area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the resolution of via formation, prevents deformation and shorts, and improves the yield and reliability of semiconductor devices by increasing the distance between via opening patterns without lowering the degree of integration.
Implementation Method 1
an optical interference phenomenon is used. By using an optical interference effect between the via patterns or the wiring patterns, an effective contrast ratio can be increased
Implementation Method 2
When the distance between the via opening patterns is smaller than the light wavelength used for the light exposure, diffracted waves come closer to each other
Data Source
AI summary
Provided is a reticle used for forming a plurality of vias for connecting first wirings provided in a first wiring layer and second wirings provided in a second wiring layer formed above the first wiring layer. The first wirings and the second wirings are provided along one of a first direction and a second direction, and the first direction and the second direction perpendicularly cross each other. The reticle includes a plurality of via opening patterns for forming the plurality of vias. Each of the plurality of via opening patterns has a rectangular shape, and is arranged to cause each side of each of the via opening patterns to be diagonal with respect to the first direction and the second direction.