Diamine-Bisanhydride Additives for Uniform Copper Plating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current electroplating bath additives fail to provide uniform copper deposits on substrates with irregular topography, particularly in areas with both through-holes and blind vias, leading to uneven metal thickness and reduced throwing power.
Innovation Solution
A reaction product of diamines and bisanhydrides is used as a leveling agent in electroplating baths, which includes a composition of metal ions, an electrolyte, and the reaction product, allowing for uniform metal deposition across substrates with varying feature sizes, effectively filling blind vias and through-holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional leveling agents are used in electroplating baths, then metal deposit uniformity is improved, but throwing power deteriorates
Solution Approach 1:
The patent changes the chemical parameters of the leveling agent by using reaction products of bisanhydrides and diamines with specific molecular structures and functional groups. These parameter changes in the additive's chemical composition improve its ability to provide uniform metal deposits while maintaining throwing power, resolving the contradiction between deposit uniformity and throwing power.
Solution Approach 2:
The patent employs composite chemical structures formed by the reaction of bisanhydrides and diamines, creating multifunctional additives that combine the properties of both parent compounds. This composite approach allows the single additive to simultaneously achieve leveling effects and maintain throwing power, addressing the contradiction between uniformity and throwing power.
2Quantity of substance
If electroplating is performed on substrates with irregular topography, then coverage of apertures is improved, but deposit uniformity deteriorates
Solution Approach 1:
The patent applies the local quality principle by designing additives that can adapt their behavior to different local conditions on the substrate surface. The reaction products of bisanhydrides and diamines provide localized effects that promote via filling in aperture regions while maintaining uniform deposit thickness on planar regions, thus resolving the contradiction between coverage and uniformity.
3Quantity of substance
If aperture depth increases, then via filling is improved, but voltage drop increases
Solution Approach 1:
The patent uses reaction products of bisanhydrides and diamines as intermediary substances that mediate between the electrical field and the metal deposition process. These additives act as intermediaries that facilitate uniform ion distribution and reduce voltage drop effects in deep apertures, enabling effective via filling without excessive voltage loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves substantially level metal layers with improved throwing power, reducing thickness variation between substrate surfaces and apertures, and effectively deposits metals in complex geometries, enhancing the manufacturing of electronic devices.
Implementation Method 1
Methods for electroplating articles with metal coatings generally involve passing a current between two electrodes in a plating solution where one of the electrodes is the article to be plated
Implementation Method 2
copper is electroplated over selected portions of the surface of a printed circuit board, into blind vias and trenches and on the walls of through-holes
Data Source
AI summary
Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.