Diamond Heat Spreader Bonded to Ceramic Frame

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Solution Overview

Problem

Existing electronic device configurations with diamond heat spreaders are often bulky and not adaptable to various device configurations due to the presence of carrier pads or ceramic substrates, which limits their use in compact applications and increases thermal resistance.

Innovation Solution

A compact electronic device component design featuring a diamond heat spreader directly bonded to an electrically insulating ceramic support frame, eliminating the need for metallic heat spreaders and allowing for improved thermal interface and flexible electrical connections, enabling direct mounting of semiconductor components on the diamond heat spreader with a ceramic support frame.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a diamond heat spreader is integrated into an electronic device package with carrier pads or ceramic substrates, then heat spreading capability is improved, but the package size increases and adaptability to different device configurations decreases

Engineering Contradiction:

Improveheat spreading capabilityVSAvoidadaptability to different device configurations

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The invention divides the heat spreader system into two separate functional components: a diamond heat spreader wafer for thermal management and a ceramic support frame for structural support and electrical connections. This segmentation allows each component to be optimized independently and adapted to different device configurations without compromising the other function.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The ceramic support frame serves multiple functions: providing mechanical support, enabling electrical connections through metallization layers, and supporting the diamond heat spreader. This multi-functionality reduces the need for additional components and enhances adaptability to various device configurations.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If a diamond heat spreader is integrated into an electronic device package with carrier pads or ceramic substrates, then heat spreading capability is improved, but the package volume increases

Engineering Contradiction:

Improveheat spreading capabilityVSAvoidpackage size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The invention merges the diamond heat spreader with the ceramic support frame by bonding the diamond wafer to the inner surface of the frame, creating a compact integrated structure. This eliminates the need for separate carrier pads and reduces overall package volume while maintaining effective heat spreading.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The diamond heat spreader wafer is nested within the ceramic support frame structure, with the diamond wafer positioned inside the frame's opening. This nesting arrangement maximizes space utilization and minimizes the overall package footprint.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Reliability

If metallic heat spreaders are used in electronic device packages, then electrical connections can be provided, but thermal conductivity and heat spreading efficiency decrease

Engineering Contradiction:

Improveelectrical connection capabilityVSAvoidthermal conductivity

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The invention uses metallization layers on the ceramic support frame as an intermediary to provide electrical connections between the diamond heat spreader and external circuitry. This allows the diamond heat spreader to maintain its superior thermal conductivity while electrical connectivity is achieved through the ceramic frame's metallized surfaces.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances thermal conductivity, reduces package size, and increases flexibility in device configurations, allowing for efficient heat transfer and adaptable electrical connections, thus improving device performance and reliability.

Implementation Method 1

diamond has unique properties as a heat spreading material, combining the highest room temperature thermal conductivity of any material

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

spread any heat generated by component devices to reduce temperatures and thus improve device performance

Methodology Applied

Scientific EffectHeat spreading: Conduction (thermal)

Data Source

PatentUS10366936B2Electronic device component with an integral diamond heat spreader

Publication Date: 2019.07.30 ELEMENT SIX TECH LTD

AI summary

An electronic device component comprising:a support frame comprising a top surface, a bottom surface, and an opening extending between the top surface and bottom surface of the support frame;a diamond heat spreader comprising a wafer of synthetic diamond material having a top face, a bottom face, wherein the diamond heat spreader is bonded to the support frame so that the diamond heat spreader extends across the opening in the support frame; andone or more semiconductor components mounted on, and bonded to, the top face of the diamond heat spreader,wherein the support frame is formed of an electrically insulating ceramic material to which the diamond heat spreader is bonded.