Diamond-Coated Chuck Tool Burls for Wafer Handling

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Solution Overview

Problem

Existing tooling technologies face challenges in reducing friction and abrasion during semiconductor wafer handling, leading to issues like wafer twisting or drooping, which can result in improper positioning and damage due to non-uniform or malformed burls on chuck tools.

Innovation Solution

A diamond-coated tool surface with protrusions, such as burls, is developed, where the diamond coating is formed with grains sized between 200 and 300 nanometers, deposited at low temperatures, and optionally doped for electrical conductivity, to provide a conformal, friction-reducing, and protective layer on tooling surfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If traditional coatings or structures are used on chuck tools, then manufacturing simplicity is maintained, but friction and abrasion increase leading to wafer damage

Engineering Contradiction:

Improvefriction and abrasionVSAvoidmanufacturing complexity

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent applies composite materials by combining diamond particles (for friction reduction) with a binder material to create a coating composition. This composite coating is applied to the chuck tool surface, providing both low friction/abrasion properties and structural integrity, thereby resolving the contradiction between reducing harmful factors and maintaining ease of manufacture.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent changes the surface parameters of the chuck tool by applying a diamond-based coating that fundamentally alters the surface properties. The diamond coating provides extreme hardness, low friction, and wear resistance, transforming the surface characteristics to eliminate wafer damage while the coating application process remains manufacturable through established techniques.

Inventive Principle:

Principle #35Parameter changes

2Object-affected harmful factors

If burls are added to reduce contact area and friction, then wafer movement is improved, but non-uniform or malformed burls cause abrasion and damage

Engineering Contradiction:

ImprovefrictionVSAvoidwafer integrity

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent applies local quality by creating a diamond coating specifically on the burl surfaces where contact with the wafer occurs. The diamond coating provides localized protection and uniformity to the burl regions, ensuring that the friction-reducing function is achieved without compromising wafer integrity through malformed or abrasive surfaces.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent substitutes the mechanical integrity of bare burl surfaces with a diamond coating layer. Instead of relying on the mechanical perfection of the underlying burl structure, the diamond coating provides a protective barrier that prevents abrasion and damage to the wafer, thereby improving reliability while maintaining the friction-reducing geometric function of the burls.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If diamond coating is applied to reduce friction and protect wafers, then wafer handling precision is improved, but coating deposition complexity increases

Engineering Contradiction:

Improvewafer positioning precisionVSAvoidcoating deposition process

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the coating application into manageable components: diamond particles as the functional material, binder material as the matrix, and optional solvents or additives. This segmented approach allows for flexible coating formulation and application method selection (such as CVD, PVD, or dip coating), reducing overall process complexity while achieving the desired precision improvement.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The diamond-coated tooling surfaces effectively reduce friction and abrasion, maintain wafer flatness, and prevent damage by ensuring uniform pressure distribution, thereby enhancing the precision and reliability of wafer handling processes.

Implementation Method 1

a diamond coating formed with grains sized so that 90% of the grains are between 200 and 300 nanometers, with the diamond coating being deposited at a temperature respectively below 600, 500, or 450 degrees Celsius

Methodology Applied

Scientific EffectVapor deposition: Physical Vapour Deposition

Data Source

PatentUS20230056012A1Diamond Structures For Tooling

Publication Date: 2023.02.23 AKHAN SEMICONDUCTOR INC

AI summary

A substrate for a tool including at least one sidewall includes at least one diamond layer. The diamond layer has a thickness between 10 nanometers and 1000 nanometers and is formed from diamond grains sized to be 50% or less of diamond layer thickness, with the diamond coating being deposited on the surface of the substrate over the at least one sidewall.