Diamond-Copper Composite Sintering for Low Thermal Resistance
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Solution Overview
Problem
Existing methods for producing composite materials with diamond and copper for heat dissipation members face challenges in achieving high thermal conductivity and compatibility due to poor adhesion and high sintering temperatures, leading to increased thermal resistance and potential detachment from semiconductor devices.
Innovation Solution
A method involving pulsed electric current sintering with pressures of 5 MPa to 100 MPa and temperatures between 500°C and 800°C is used to produce a composite material, utilizing a bimodal particle size distribution and avoiding additional metal coatings to enhance adhesion and reduce thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If diamond particles are sintered with copper using conventional methods at high temperatures (800°C or greater), then the composite material can be formed, but thermal resistance increases and adhesion deteriorates
Solution Approach 1:
The patent applies pulsed electric current sintering with a specific temperature range (500-800°C) and pressure range (5-100 MPa) to achieve optimal adhesion between diamond particles and copper matrix, resolving the contradiction between forming a composite material and maintaining low thermal resistance
2Reliability
If additional metal coatings are applied to diamond particles before sintering, then adhesion may improve, but thermal resistance increases due to intermediate layers
Solution Approach 1:
The patent removes the intermediate metal coating layer that was previously applied to diamond particles, achieving direct bonding between diamond and copper through optimized pulsed electric current sintering parameters, thereby eliminating the thermal resistance caused by intermediate layers
Solution Approach 2:
The patent uses the copper matrix itself as the bonding intermediary through controlled sintering, replacing the need for additional metal coating intermediaries that would increase thermal resistance
3Strength
If high pressure is applied during sintering to improve adhesion, then bonding strength increases, but the complexity of the sintering process increases
Solution Approach 1:
The patent replaces conventional mechanical sintering methods with pulsed electric current sintering, which uses electrical energy and electromagnetic fields to achieve bonding, simplifying the process control while maintaining high bonding strength through precise parameter control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a composite material with improved thermal conductivity, reducing thermal resistance and minimizing detachment risks, suitable for heat dissipation applications.
Implementation Method 1
pulsed electric current sintering with a pressure of 5 MPa or greater and 100 MPa or less applied to the mixed powder and with the mixed powder maintained at a temperature equal to or higher than 500° C. and lower than 800° C.
Implementation Method 2
pulsed electric current sintering with a pressure of 5 MPa or greater and 100 MPa or less applied to the mixed powder
Data Source
AI summary
A method of producing a composite material, the method including: preparing a mixed powder of diamond particles and copper powder particles; and generating a composite material containing diamond and copper from the mixed powder by pulsed electric current sintering with a pressure of 5 MPa or greater and 100 MPa or less applied to the mixed powder, and the mixed powder maintained at a temperature equal to or higher than 500° C. and lower than 800° C.