Shaped Diamond Die Bearing Surface for Smoother Wire Drawing
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Solution Overview
Problem
Conventional shaped diamond dies result in large surface roughness of wire materials after drawing, which is a significant technical challenge.
Innovation Solution
A shaped diamond die with a surface roughness of the bearing portion of 0.05 µm or less, a smooth curved machining hole surface, continuous polycrystalline diamond around the machining hole, and a binder ratio of 5 vol% or less, which reduces the surface roughness of the wire material by enhancing the accuracy and strength of the machining process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional shaped diamond dies are used, then the wire drawing process can be performed, but the surface roughness of the wire material becomes large
Solution Approach 1:
The patent applies local quality by creating a bearing portion with specifically controlled surface roughness (0.05 µm or less) that is distinct from other portions of the die. This localized precision in the bearing portion directly contacts the wire material during drawing, ensuring low surface roughness of the drawn wire while maintaining the overall structural integrity and functionality of the die
2Manufacturing precision
If the surface roughness of the bearing portion is reduced to 0.05 µm or less, then the wire material surface roughness improves, but the manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the surface roughness parameter of the bearing portion to be 0.05 µm or less. This parameter control is achieved through specific manufacturing processes that ensure the bearing portion meets the required surface quality without requiring complex structural modifications to the overall die design
3Manufacturing precision
If the average grain size of polycrystalline diamond is reduced to 500 nm or less, then the surface roughness of wire material decreases, but the manufacturing difficulty increases
Solution Approach 1:
The patent applies parameter changes by controlling the average grain size of the polycrystalline diamond to 500 nm or less. This grain size parameter control enables the achievement of low surface roughness (0.05 µm or less) in the bearing portion while managing the manufacturing process through established polycrystalline diamond fabrication techniques
Data Source
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AI summary
A shaped diamond die includes a polycrystalline diamond, the polycrystalline diamond having a machining hole, wherein a length D of a side of the machining hole is 100 µm or less, a corner R is 20 µm or less, the shaped diamond die includes a bearing portion, a surface roughness Sa of the bearing portion is 0.05 µm or less, and an average grain size of the polycrystalline diamond is 500 nm or less.