Diamond-Filled Dielectric Substrate for PCB Heat Dissipation

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Solution Overview

Problem

Existing dielectric materials in integrated circuits exhibit poor thermal conductivity, making it difficult to dissipate heat from components like CPUs and power management units.

Innovation Solution

Incorporating diamond dust as a filler material in dielectric materials within substrates and printed circuit boards to enhance thermal conductivity and heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional dielectric materials are used in PCB and substrate construction, then electrical insulation is achieved, but thermal conductivity is poor making heat dissipation difficult

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidthermal conductivity

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies composite materials by combining diamond dust particles with dielectric material to create a hybrid substrate structure. The diamond dust provides high thermal conductivity while the dielectric material maintains electrical insulation properties, resolving the contradiction between thermal performance and electrical functionality.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent changes the thermal conductivity parameter of the dielectric material by incorporating diamond dust fillers. This modifies the physical properties of the material to achieve improved heat dissipation while maintaining the required electrical insulation characteristics, directly addressing the thermal conductivity deficiency of traditional dielectrics.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If diamond dust is added to dielectric material to improve thermal conductivity, then heat dissipation is enhanced, but material composition complexity increases

Engineering Contradiction:

Improvethermal conductivityVSAvoidmaterial composition

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent utilizes a porous or particulate composite structure where diamond dust particles are distributed within the dielectric matrix. This approach enhances thermal conductivity through the high thermal conductivity pathways provided by diamond particles while maintaining the base dielectric material's insulation properties, managing complexity through a structured composite approach.

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Diamond dust significantly improves thermal conductivity, allowing for effective heat dissipation from hotspots in electronic devices, particularly when used in high-stack substrates with varying percentages based on heat dissipation needs.

Implementation Method 1

diamond dust has no or low electrical conductivity, similar to other commonly-used dielectric materials... diamond dust significantly improves thermal conductivity, allowing for effective heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12538797B2Substrate for improved heat dissipation and method

Publication Date: 2026.01.27 INTEL CORP

AI summary

A semiconductor package comprises a package substrate comprised of at least a first layer of dielectric material including a portion of diamond dust material. The diamond dust material is comprised of diamond dust particles. The semiconductor package includes at least one electrical connection coupled through layers of the package substrate.