Laser-Graphitized Diamond Cutting Edge for Wear and Strength

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Solution Overview

Problem

Diamond tools used for cutting difficult materials like cemented carbides suffer from insufficient cutting edge strength and frequent defects, despite having improved wear resistance due to a graphite layer, which is not adequately addressed by existing technologies.

Innovation Solution

A diamond tool with a moderate amount of graphite phase on the cutting edge, formed using laser processing, which enhances sliding properties and defect resistance without compromising strength, characterized by a specific ratio of graphite to diamond intensity, and a structure comprising single crystal, binderless polycrystalline, or polycrystalline sintered diamond.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a graphite layer is actively precipitated on the flank face by electric discharge machining to improve wear resistance, then flank face wear resistance is improved through lubricating properties, but cutting edge strength becomes insufficient for cutting materials that are difficult to cut

Engineering Contradiction:
Improveflank face wear resistanceVSAvoidcutting edge strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The invention applies local quality by creating a graphite layer with specific characteristics (amorphous or microcrystalline structure, controlled thickness of 0.1-5 μm) only on the flank face and rake face surfaces, while maintaining the diamond phase integrity in the cutting edge region. This localized treatment provides lubrication where needed without compromising the overall cutting edge strength

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The invention changes the parameters of the graphite layer by controlling its structure (amorphous or microcrystalline), thickness (0.1-5 μm), and distribution on the tool surfaces. These parameter changes optimize the balance between lubrication effectiveness and cutting edge strength, resolving the contradiction between wear resistance and strength

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The diamond tool exhibits significantly improved defect resistance and wear resistance, making it suitable for applications in cutting tools and anti-wear tools, while maintaining the hardness of diamond grains.

Implementation Method 1

a laser beam is irradiated onto a cutting edge of a diamond tool

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 2

transforming a diamond phase into a graphite phase by heating with a laser beam

Methodology Applied
Scientific EffectThermal conversion: Heating

Implementation Method 3

the wear of the cutting edge becomes severe during machining... the lubricating properties of the graphite layer... improved sliding properties

Methodology Applied
Scientific EffectLubrication: Lubrication

Data Source

PatentEP4049776B1Diamond tool
Publication Date: 2024.11.13 SUMITOMO ELECTRIC HARDMETAL CORP
  • EP4049776B1 patent drawingFigure 1

AI summary

A diamond tool includes a diamond at least on a cutting edge. The diamond includes one or two or more diamond grains. The diamond grain includes a diamond phase composed of a diamond crystal structure and a graphite phase composed of a graphite crystal structure. When a ratio Iπ∗/Iσ∗ between an intensity of a π∗ peak derived from a π bond of carbon in the graphite phase and an intensity of a σ∗ peak derived from a σ bond of carbon in the graphite phase and a σ bond of carbon in the diamond phase is determined for the diamond grain by measuring an energy loss associated with excitation of K-shell electrons of carbon by electron energy loss spectroscopy using a transmission electron microscope, the ratio Iπ∗/Iσ∗ of the diamond grain on a surface of the cutting edge is 0.1 to 2 and a ratio Iπ∗/Iσ∗ of the diamond grain at a depth position of 0.5 µm in a normal direction to the surface of the cutting edge from the surface of the cutting edge is 0.001 to 0.1.