Single-Crystal Diamond Cutting Edge Laser Machining Without Chipping
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Solution Overview
Problem
Single crystal diamond cutting tools are prone to cracking or chipping during laser machining due to low laser absorptivity, which existing methods fail to adequately address.
Innovation Solution
A method involving the use of a laser with a pulse width of 1×10^-12 seconds or less and a peak output of less than 1 W is applied along the cutting edge from the flank face, combined with nitrogen impurity concentration between 20 ppm and 70 ppm to improve fracture and wear resistance, and precise laser angles to prevent cracking and chipping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser machining is applied to single crystal diamond cutting insert, then cutting edge can be formed, but cracking or chipping occurs due to low laser absorptivity
Solution Approach 1:
The patent applies a laser with pulse width of 1×10^-12 seconds or less and peak output of 1 W or less, which are specific parameter changes from conventional laser settings. This ultra-short pulse duration prevents heat accumulation that causes cracking while maintaining sufficient energy to form the cutting edge on low-absorptivity single crystal diamond material
Solution Approach 2:
The patent uses pulsed laser irradiation instead of continuous laser application. The periodic pulsed action with extremely short duration (1×10^-12 seconds or less) allows the material to cool between pulses, preventing thermal stress accumulation that leads to cracking and chipping during cutting edge formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents cracking and chipping in diamond single crystal materials, enhances machining stability, and maintains the sharpness and accuracy of the cutting edge.
Implementation Method 1
a laser to be applied along the cutting edge to a diamond single crystal material from which the rake face is seen, has a pulse width of 1×10^-12[0005] The laser beam is applied along a cutting edge to a diamond single crystal material from which a rake face is seen, has a pulse width of 1×10^-12
Data Source
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AI summary
A method for manufacturing a cutting tool according to one embodiment is a method for manufacturing a cutting tool, the cutting tool including a base material and a diamond single crystal material fixed to the base material, the diamond single crystal material having a rake face, a flank face continuous with the rake face, and a cutting edge formed by a ridgeline serving as a boundary between the rake face and the flank face. The method for manufacturing a cutting tool according to one form of the present disclosure includes a flank face irradiation step of applying a laser to the diamond single crystal material along the cutting edge from a side of the flank face. The laser has a pulse width of 1×10-12 seconds or less and a peak output of less than 1 W in the flank face irradiation step.